Leading precision ceramics & power semiconductor companies across the full industry chain
2 exhibitors
We are a specialized solder manufacturer dedicated to the R&D, production, and customization of high-end precision solder preforms. With years of deep expertise in precision brazing materials, we possess mature production processes, a comprehensive quality control system, and stable supply capabilities. We are committed to providing high-quality, highly compatible soldering solutions for industries such as electronic packaging, precision components, and high-end ceramic packaging. Our core product portfolio includes solder preforms in various specifications—such as gold-tin and silver-copper alloys—as well as low/high-temperature solders, SMT solders, solder wires, solder spheres, fluxes, nano-sintering silver pastes, pre-coated solders, and cleaning agents. Characterized by extensive variety, high precision, and excellent consistency, our precision solder preforms can be customized in terms of dimensions, thickness, and alloy composition to meet specific product structures, soldering processes, and temperature requirements. Designed for diverse precision brazing applications, our products effectively address common industry challenges—such as uneven soldering, solder overflow, high void rates, and poor sealing—while ensuring high joint strength, superior electrical conductivity, and excellent thermal stability.
Located in the High-tech Zone of Shanwei City, Guangdong Province, and covering an area of 14,000 square meters, Shanwei Suosi Electronic Packaging Materials Co., Ltd. is a national high-tech enterprise. The company offers integrated solutions for advanced packaging materials and operates two major production bases (in Shanwei and Hefei), utilizing three core processes and four proprietary, controllable technologies. It is the first domestic supplier to achieve full-process localization—spanning R&D and production—for advanced packaging materials. Since its inception, the company has prioritized technological innovation, focusing on the application of novel solders in fields such as high-reliability semiconductor packaging, microelectronics, and high-power optoelectronic packaging; it has secured numerous patents for inventions and utility models. Suosi Electronic’s main products include solder preforms, pre-applied Au-Sn lids, crystal oscillator lids, LTCC ceramic substrates, HTCC ceramic substrates, surface treatments (electroplated Ni/Au and electroless Ni/Au), package housing machining, and precision machining for scientific instruments.
