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Exhibitor List

Leading precision ceramics & power semiconductor companies across the full industry chain

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Tags: All Ceramic Substrate AMB DPC Sintering Furnace Alumina Silicon Nitride Ceramic Package MLCC Aluminum Nitride Ceramics Inspection Equipment Diamond Isostatic Press Ceramic Structural Parts Zirconia Powder Electronic Paste Printing Machine Materials Microwave Dielectric Ceramics Heat Sink Stacking Machine Equipment LTCC Binder Tape Caster Laser Equipment Auxiliary HTCC Drilling Machine DBC Sand Mill Metal Powder Boron Nitride High-Temperature Furnace Barium Titanate Dicing Saw Precious metal Coating Equipment Packaging Conductive Materials Rare Earth Oxide Refractory Materials Electroplating Equipment Consumables Screen Mesh Grinding & Polishing Equipment Additive Cleaning Others Solder Semiconductor Ceramics Titanium Dioxide Dispersant Silicon Carbide Ceramics Release Film Semiconductor Electroplating Chemicals Copper Clad Laminate PCB Robot Cutting Machine Filter Cartridge Mixer SOFC Scintillation Ceramics Transparent Ceramics Degassing Machine Piezoelectric Ceramics Grinding Consumables IGBT Vacuum Brazing Black Ceramics Wet Process Horizontal Line Metallization Servo Press Polishing Consumables Dry Press Mold Machining Zirconia Beads Packaging Equipment Green Ceramic Tape Thermally & Electrically Conductive Adhesive Vacuum Valve AOI Inspection Debinding Furnace Termination Machine Film Thickness Gauge Pusher Furnace Filter Nanomaterials Chip Packaging Heating Element Semiconductor Equipment Homogenizer Resin Laser Soldering Machine Advanced Ceramics Thermocouple RTD Punch Press Process Chemicals Spray Granulation Boron Carbide Tungsten-Molybdenum Powder Microscope Cutting Equipment Carrier Leveling Machine Termination Equipment Bonder Parallel Seam Sealer Eutectic Bonder Taping Machine Setter Plate Sandblasting Equipment Machining Center Components Adhesive Tape Thermal Insulation Materials

6 exhibitors

Shijiazhuang FC Electronic Technology Co., Ltd

Ceramic SubstrateCeramic PackageAluminum NitrideHeat SinkPackaging

Established in 2022, Shijiazhuang Fengce Electronic Technology Co., Ltd. is led by a core team with over 20 years of experience in the semiconductor industry, focusing primarily on ceramic-substrate SiP (System-in-Package) packaging. The company specializes in the R&D and manufacturing of TCV (Through-Ceramic-Via) ceramic thin-film processes and advanced packaging for digital SiP modules. Its product portfolio includes ceramic IPD filters, DPC ceramic packages, DPC heat sink substrates, aluminum nitride (AlN) carriers for optical modules, TCV multilayer ceramic carriers, and Mini-LED substrates.

Chengdu Xuci New Material Co.,Ltd / Ningxia Northceramic New Material Technology Co.,Ltd

Ceramic SubstrateCeramic PackageAluminum NitrideCeramicsHTCCSemiconductor Ceramics

Chengdu Xuci New Materials Co., Ltd. and Ningxia Beici New Materials Technology Co., Ltd. were established in late 2020 and early 2021, respectively, occupying a combined area of ​​100,000 square meters with a total investment of RMB 550 million. Integrating R&D, production, sales, and technical services, the company possesses full-chain mass production capabilities for commercial-grade aluminum nitride (AlN) powders, substrates, structural components, HTCC (High-Temperature Co-fired Ceramic) products, and high-end functional devices. With core equipment developed in-house and over 30 patent applications filed, the company was certified as a National High-Tech Enterprise in 2023. We are dedicated to providing customers with comprehensive, one-stop solutions for aluminum nitride materials; our products serve a wide range of sectors—including LED packaging, high-power power electronics modules, PV energy storage, inverters, charging piles, new energy, automotive electronics, telecommunications, RF/microwave communication, and aerospace—and have earned widespread recognition from domestic and international clients.

The 43rd Research Institute of China Electronics Technology Group Corporation

Ceramic PackageHTCC

Microwave devices, ceramic packages

Beijing Yuanliu Hongyuan Electronic Technology Co., Ltd.

Ceramic PackageMLCCMicrowave Dielectric CeramicsFilter

Beijing Yuanliu Hongyuan Electronic Technology Co., Ltd. (603267.SH) is a company listed on the Main Board of the Shanghai Stock Exchange. Its core business encompasses the R&D, manufacturing, and sales of electronic components. As a key manufacturer of multilayer ceramic capacitors for high-reliability applications in China, the company has been recognized as a national-level "Little Giant" enterprise (specializing in niche markets with cutting-edge technologies) and has ranked among China's key electronic component enterprises for 13 consecutive years.

CYCX ceramic packaging

Ceramic SubstrateCeramic PackageElectronic PasteHTCCBlack CeramicsMetallization

Green ceramic tapes, metal pastes, ceramic packages, high-temperature co-fired ceramic (HTCC) heating elements, HTCC, LED ceramic substrates, ceramic metallization.

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Sidao Technology (Suzhou) Co., Ltd.

Ceramic SubstrateCeramic PackageAluminum Nitride

Sidao Technology (Suzhou) Co., Ltd. is a high-tech advanced-ceramics company integrating R&D, production and sales. Its leading products are high-end electronic ceramic substrates in aluminum nitride, ZTA, silicon nitride and alumina.

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