Aibang Expo Exhibition Scope
8 sections covering the full precision ceramics & power semiconductor industry chain
Ceramic Devices & Materials
MLCC, LTCC, HTCC, microwave dielectric & piezoelectric ceramics, BaTiO3, alumina/zirconia, AlN powder, green tape
View DetailsPrecision Structural Ceramics
Zirconia, alumina, AlN, Si3N4, SiC, ceramic bearings, semiconductor ceramics (ESC, etching rings), 3D-printed & bio ceramics
View DetailsCeramic Substrates & Packaging
Ceramic packaging housings; DPC, DBC, AMB, HTCC, and LTCC substrates; thin-film and thick-film circuit boards; ceramic packaging bases; heat sinks; alumina, aluminum nitride, silicon nitride, beryllium oxide, and mullite powders and substrates; etc.
View DetailsMetal Materials & Electronic Pastes
Silver/copper/nickel powder, electrode & LTCC pastes, W-Mo paste, targets, OFC strip, Kovar alloy
View DetailsPower Semiconductor Packaging
SiC, DBC/AMB substrates, packages, bonding wire, AlSiC heat sinks, thermal gel, solder preforms, Cu terminals
View DetailsCeramic Processing Equipment
Sand/ball mills, tape casters, isostatic presses, screen printers, lamination, debinding & sintering furnaces, laser drilling
View DetailsPackaging & Testing Equipment
Die bonders, wire bonders, sealing/seam welding, X-ray, He leak test, SAM, AOI, test & sorting
View DetailsAdditives & Consumables
Dispersants, binders, plasticizers, sintering aids, release film, carrier tape, setters/saggars, abrasives
View Details