Ceramic Substrates & Packaging
Ceramic packaging housings; DPC, DBC, AMB, HTCC, and LTCC substrates; thin-film and thick-film circuit boards; ceramic packaging bases; heat sinks; alumina, aluminum nitride, silicon nitride, beryllium oxide, and mullite powders and substrates; etc.
Exhibition Scope
Ceramic Circuit Substrates
DPC, DBC, AMB, HTCC/LTCC substrates, thin/thick film circuits
Ceramic Packages
Ceramic packages & bases, heat sinks, BeO/AlN/mullite substrates
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