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Exhibitor List

Leading precision ceramics & power semiconductor companies across the full industry chain

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Tags: All Ceramic Substrate AMB DPC Sintering Furnace Alumina Silicon Nitride Ceramic Package MLCC Aluminum Nitride Ceramics Inspection Equipment Diamond Isostatic Press Ceramic Structural Parts Zirconia Powder Electronic Paste Printing Machine Materials Microwave Dielectric Ceramics Heat Sink Stacking Machine Equipment LTCC Binder Tape Caster Laser Equipment Auxiliary HTCC Drilling Machine DBC Sand Mill Metal Powder Boron Nitride High-Temperature Furnace Barium Titanate Dicing Saw Precious metal Coating Equipment Packaging Conductive Materials Rare Earth Oxide Refractory Materials Electroplating Equipment Consumables Screen Mesh Grinding & Polishing Equipment Additive Cleaning Others Solder Semiconductor Ceramics Titanium Dioxide Dispersant Silicon Carbide Ceramics Release Film Semiconductor Electroplating Chemicals Copper Clad Laminate PCB Robot Cutting Machine Filter Cartridge Mixer SOFC Scintillation Ceramics Transparent Ceramics Degassing Machine Piezoelectric Ceramics Grinding Consumables IGBT Vacuum Brazing Black Ceramics Wet Process Horizontal Line Metallization Servo Press Polishing Consumables Dry Press Mold Machining Zirconia Beads Packaging Equipment Green Ceramic Tape Thermally & Electrically Conductive Adhesive Vacuum Valve AOI Inspection Debinding Furnace Termination Machine Film Thickness Gauge Pusher Furnace Filter Nanomaterials Chip Packaging Heating Element Semiconductor Equipment Homogenizer Resin Laser Soldering Machine Advanced Ceramics Thermocouple RTD Punch Press Process Chemicals Spray Granulation Boron Carbide Tungsten-Molybdenum Powder Microscope Cutting Equipment Carrier Leveling Machine Termination Equipment Bonder Parallel Seam Sealer Eutectic Bonder Taping Machine Setter Plate Sandblasting Equipment Machining Center Components Adhesive Tape Thermal Insulation Materials

8 exhibitors

Sidao Technology (Suzhou) Co., Ltd.

Booth: C05

Ceramic SubstrateCeramic PackageAluminum Nitride

Sidao Technology (Suzhou) Co., Ltd. is a high-tech advanced-ceramics company integrating R&D, production and sales. Its leading products are high-end electronic ceramic substrates in aluminum nitride, ZTA, silicon nitride and alumina.

SHENZHEN ZHENJIN NEW CERAMIC, ELECTRONIC MATERIALS TECHNOLOGY CO., LTD

Booth: C14

Ceramic SubstrateAluminaAluminum NitrideMicrowave Dielectric CeramicsSemiconductor CeramicsPiezoelectric Ceramics

The core team at Zhenjin New Ceramics has been deeply engaged in the R&D of advanced ceramic materials since 2019. Following five years of technical development and market exploration, the company was officially established in May 2024 and commenced capital-backed operations; it is a next-generation electronic ceramics supplier focused on innovation in cutting-edge ceramic materials. The company’s core product portfolio includes aluminum nitride substrates, silicon carbide vacuum chucks, and various ceramic structural components. These products are widely applicable in high-growth sectors such as high-power horticultural lighting, laser equipment, semiconductor packaging, aerospace, telecommunications and energy, and temporary bonding/debonding processes for semiconductor handling. Aluminum Nitride Substrates, Black Alumina Substrates, Ceramic Vacuum Chucks

KBC CORPORATION,LTD.

Booth: C25

Aluminum NitridePowder

Since its establishment in 2005, Hunan Jinbo Carbon Co., Ltd. has consistently focused on the R&D, production, and sales of advanced new materials, serving strategic emerging industries such as photovoltaics, semiconductors, lithium batteries, hydrogen energy, and automotive manufacturing. Possessing robust independent R&D and continuous innovation capabilities, the company has spearheaded numerous major national scientific research projects, including a major special project under the National "863 Program," a key project funded by the Ministry of Science and Technology's Innovation Fund, and a high-tech industrialization demonstration project supported by the National Development and Reform Commission. It has formulated five industry standards and earned accolades such as "National Key High-Tech Enterprise under the Torch Program," "National Intellectual Property Demonstration Enterprise," and recognition by the Ministry of Industry and Information Technology as one of the first batch of "Little Giant" enterprises (specialized, refined, distinctive, and innovative) and a "Single Champion Enterprise in Manufacturing." Additionally, the company has been honored with the "National May 1st Labor Certificate" and the First Prize of the Hunan Province Science and Technology Progress Award.

Shijiazhuang FC Electronic Technology Co., Ltd

Booth: C51

Ceramic SubstrateCeramic PackageAluminum NitrideHeat SinkPackaging

Established in 2022, Shijiazhuang Fengce Electronic Technology Co., Ltd. is led by a core team with over 20 years of experience in the semiconductor industry, focusing primarily on ceramic-substrate SiP (System-in-Package) packaging. The company specializes in the R&D and manufacturing of TCV (Through-Ceramic-Via) ceramic thin-film processes and advanced packaging for digital SiP modules. Its product portfolio includes ceramic IPD filters, DPC ceramic packages, DPC heat sink substrates, aluminum nitride (AlN) carriers for optical modules, TCV multilayer ceramic carriers, and Mini-LED substrates.

Chengdu Xuci New Material Co.,Ltd / Ningxia Northceramic New Material Technology Co.,Ltd

Booth: F27

Ceramic SubstrateCeramic PackageAluminum NitrideCeramicsHTCCSemiconductor Ceramics

Chengdu Xuci New Materials Co., Ltd. and Ningxia Beici New Materials Technology Co., Ltd. were established in late 2020 and early 2021, respectively, occupying a combined area of ​​100,000 square meters with a total investment of RMB 550 million. Integrating R&D, production, sales, and technical services, the company possesses full-chain mass production capabilities for commercial-grade aluminum nitride (AlN) powders, substrates, structural components, HTCC (High-Temperature Co-fired Ceramic) products, and high-end functional devices. With core equipment developed in-house and over 30 patent applications filed, the company was certified as a National High-Tech Enterprise in 2023. We are dedicated to providing customers with comprehensive, one-stop solutions for aluminum nitride materials; our products serve a wide range of sectors—including LED packaging, high-power power electronics modules, PV energy storage, inverters, charging piles, new energy, automotive electronics, telecommunications, RF/microwave communication, and aerospace—and have earned widespread recognition from domestic and international clients.

Yibin Red-star Electronics Co., Ltd.

Booth: F58

Ceramic SubstrateAMBAluminaSilicon NitrideAluminum NitrideDBC

Silicon nitride, aluminum nitride, aluminum oxide, beryllium oxide, AMB, and DBC ceramic substrates

Zhuzhou Ascendus New Material Technology CO., LTD

Booth: G20

Ceramic SubstrateSilicon NitrideAluminum NitrideCeramic Structural Parts

Aluminum nitride powder, silicon nitride substrate, aluminum nitride substrate, structural parts, etc.

Jiangsu Bree Optronics Co., Ltd.

Booth: G43

Ceramic SubstrateAMBDPCSilicon NitrideAluminum NitrideCopper Clad Laminate

Jiangsu Borui Optoelectronics Co., Ltd. is located in the state-level Nanjing Jiangning High-tech Industrial Park and specializes in the R&D and industrialization of third-generation semiconductor optoelectronic materials. Its business encompasses key areas of third-generation semiconductor packaging, including rare-earth luminescent materials, high-thermal-conductivity ceramic substrates, and interface bonding materials. The company is a leading player in my country’s semiconductor lighting and display phosphor sector, boasting the largest market share, industrial scale, and R&D capabilities; it also serves as a major global phosphor supplier and strategic partner to international lighting enterprises such as Signify, Seoul Semiconductor, and Osram.

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