Leading precision ceramics & power semiconductor companies across the full industry chain
2 exhibitors
Established in 2022, Shijiazhuang Fengce Electronic Technology Co., Ltd. is led by a core team with over 20 years of experience in the semiconductor industry, focusing primarily on ceramic-substrate SiP (System-in-Package) packaging. The company specializes in the R&D and manufacturing of TCV (Through-Ceramic-Via) ceramic thin-film processes and advanced packaging for digital SiP modules. Its product portfolio includes ceramic IPD filters, DPC ceramic packages, DPC heat sink substrates, aluminum nitride (AlN) carriers for optical modules, TCV multilayer ceramic carriers, and Mini-LED substrates.
Foshan Foda Huakang Technology Co., Ltd. was established in 2005 and is headquartered in Foshan, Guangdong. The company was founded by a team comprising outstanding young innovators in science and technology, senior engineers, and experienced professors. It is recognized as a National High-Tech Enterprise, a "Specialized, Refined, Unique, and Innovative" (SRUI) enterprise, and a Guangdong Province enterprise integrating industry and education. The company specializes in comprehensive solutions for chip cavity packaging. Its product portfolio includes new materials for cavity packaging; B-stage and C-stage epoxy adhesives; B-stage adhesive films and rings; lidded covers (using LCP, ceramic, glass, or metal); cavity packaging housings (ACS, ACC, QFN); and precision metal parts. Additionally, the company provides equipment for isothermal cavity packaging and sealing processes, as well as comprehensive technical solutions for the entire isothermal cavity packaging workflow. Its products and solutions are widely used by R&D and manufacturing enterprises in high-end sectors such as military electronics, RF communication chips, microwave and radar systems, optical chips, AR/AI chips, optical communication chips, MEMS sensors, cavity-packaged chips, power management chips, automotive electronics, and medical devices.
