Leading precision ceramics & power semiconductor companies across the full industry chain
2 exhibitors
Booth: C10
Foshan Foda Huakang Technology Co., Ltd. was established in 2005 and is headquartered in Foshan, Guangdong. The company was founded by a team comprising outstanding young innovators in science and technology, senior engineers, and experienced professors. It is recognized as a National High-Tech Enterprise, a "Specialized, Refined, Unique, and Innovative" (SRUI) enterprise, and a Guangdong Province enterprise integrating industry and education. The company specializes in comprehensive solutions for chip cavity packaging. Its product portfolio includes new materials for cavity packaging; B-stage and C-stage epoxy adhesives; B-stage adhesive films and rings; lidded covers (using LCP, ceramic, glass, or metal); cavity packaging housings (ACS, ACC, QFN); and precision metal parts. Additionally, the company provides equipment for isothermal cavity packaging and sealing processes, as well as comprehensive technical solutions for the entire isothermal cavity packaging workflow. Its products and solutions are widely used by R&D and manufacturing enterprises in high-end sectors such as military electronics, RF communication chips, microwave and radar systems, optical chips, AR/AI chips, optical communication chips, MEMS sensors, cavity-packaged chips, power management chips, automotive electronics, and medical devices.
Booth: D43
Zhengzhou Zhongke Institute of Integrated Circuit and System Application was approved by the Zhengzhou municipal government in December 2019. Its advanced packaging (micro-assembly) production base began operation in December 2023. With 2,000 m² of Class 10,000 cleanroom and a solid team, it offers chip designers, research institutes and system makers one-stop services for ceramic-metal packaged microwave modules and sensors—from design support and prototyping to volume foundry and test/validation. The base has more than 70 pieces of process equipment covering electrical assembly, integrated assembly and welding, cleaning, eutectic attach, epoxy attach, bonding, sealing, test and screening. Capacity, measured on 8-channel Ku-band T/R modules, is 100,000 channels/year and can expand to 150,000. First-pass assembly yield is ≥92% and full-flow manufacturing yield is ≥98%. Flexible multi-chip stacked SiP packaging capacity is 20,000 sets/year.
