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3 exhibitors

Hunan Juneng Ceramic Materials Co., Ltd.

DPCAluminaMicrowave Dielectric CeramicsHeat Sink

Hunan Juneng Ceramic Materials Co., Ltd. was established in October 2015 and is located in Building A4 of the Special Ceramics Industrial Park within the Xinhua High-tech Zone, Hunan Province. With a registered capital of RMB 10 million and a total investment of RMB 45 million, the company specializes in the production of alumina ceramic (95% and 99% purity) circuit boards and aluminum nitride ceramic circuit boards. It is an innovative technology enterprise integrating R&D, production, and sales. The facility spans a workshop area of ​​6,000 square meters and is equipped with comprehensive machinery and advanced production processes. The company employs a workforce of 80 people—including 10 engineers with over five years of professional experience—and boasts a monthly production capacity of 50,000 units. Committed to total quality management, the company holds IATF 16949:2015 and ISO 14001:2015 certifications and was recognized as a High-tech Enterprise in December 2020.

Shijiazhuang FC Electronic Technology Co., Ltd

Ceramic SubstrateCeramic PackageAluminum NitrideHeat SinkPackaging

Established in 2022, Shijiazhuang Fengce Electronic Technology Co., Ltd. is led by a core team with over 20 years of experience in the semiconductor industry, focusing primarily on ceramic-substrate SiP (System-in-Package) packaging. The company specializes in the R&D and manufacturing of TCV (Through-Ceramic-Via) ceramic thin-film processes and advanced packaging for digital SiP modules. Its product portfolio includes ceramic IPD filters, DPC ceramic packages, DPC heat sink substrates, aluminum nitride (AlN) carriers for optical modules, TCV multilayer ceramic carriers, and Mini-LED substrates.

Best Technology Circuit Co., Ltd

DPCHeat Sink

BEST's main products include thick-film ceramic boards, high-frequency attenuators, high-frequency loads, high-voltage resistors, high-resistance resistors, high-power resistors, thick-film hybrid circuits, automotive thick-film sensors, chip specialty resistors, and DPC, DBC, HTCC, LTCC, AMB and thin-film ceramic boards.

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