Leading precision ceramics & power semiconductor companies across the full industry chain
1 exhibitors
Booth: H04
Established in 2020, Suzhou Hongpai Technology Co., Ltd. is an enterprise dedicated to the R&D and production of specialized, high-end electronic pastes and co-fired ceramic materials. Located in Building 12, Northwest Zone of Nano City (No. 99 Jinjihu Avenue, Suzhou Industrial Park), the company occupies a 3,300-square-meter facility and employs a full-time staff of 48, including two PhD holders and five master's degree holders. It has a paid-in registered capital of RMB 11.98 million and an annual sales revenue of RMB 200 million. Tailoring its approach to industry product characteristics, the company prioritizes the accumulation of core technologies and focuses on the intersection of diverse material systems. Its technical expertise spans the research and production of a comprehensive material portfolio—ranging from room-temperature curing to 1800°C high-temperature sintering—covering conductor, resistor, dielectric, insulating, and encapsulation pastes, as well as green ceramic tapes. The company integrates a wide array of materials, including precious metals (Au, Ag, Pt, Pd, RuO₂), base metals (W, Mo, Mn, Cu, Ni), carbon (C), boron nitride (BN), and various ceramics and glasses. Its core business encompasses six major product categories: electronic pastes for hybrid thick-film circuits; pastes and green tapes for high- and low-temperature co-fired ceramic (HTCC/LTCC) components; pastes for chip components such as multilayer ceramic capacitors (MLCCs) and inductors; resin/organometallic pastes; low-temperature curing pastes for biosensors and flexible substrates (PET/PI); and conductive/thermal adhesives alongside low-temperature sintering silver pastes.
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