Leading precision ceramics & power semiconductor companies across the full industry chain
7 exhibitors
Wuhan Kunyuan Tape Casting Technology Co., Ltd., based in Wuhan, Hubei Province, specializes in the manufacture of equipment such as ceramic tape casting machines, warm isostatic presses, warm water isostatic presses, vacuum degassers, cutting machines, ball mills, and laminating presses. Its equipment is widely used in complete tape casting production lines for products including SOFCs, LTCCs, HTCCs, MLCCs, functional thin-film materials, piezoelectric ceramics, ceramic substrates, chip-type ceramic components, flexible magnetic films, and solid oxide fuel cells.
Chengdu Xuci New Materials Co., Ltd. and Ningxia Beici New Materials Technology Co., Ltd. were established in late 2020 and early 2021, respectively, occupying a combined area of 100,000 square meters with a total investment of RMB 550 million. Integrating R&D, production, sales, and technical services, the company possesses full-chain mass production capabilities for commercial-grade aluminum nitride (AlN) powders, substrates, structural components, HTCC (High-Temperature Co-fired Ceramic) products, and high-end functional devices. With core equipment developed in-house and over 30 patent applications filed, the company was certified as a National High-Tech Enterprise in 2023. We are dedicated to providing customers with comprehensive, one-stop solutions for aluminum nitride materials; our products serve a wide range of sectors—including LED packaging, high-power power electronics modules, PV energy storage, inverters, charging piles, new energy, automotive electronics, telecommunications, RF/microwave communication, and aerospace—and have earned widespread recognition from domestic and international clients.
Established in 2010, Shanghai Xuanting Screen Printing Equipment Co., Ltd. specializes in the R&D and manufacturing of high-precision thick-film circuit printing machines. Our equipment is widely used in manufacturing processes—such as surface printing, via filling, through-hole processing, sidewall coating, and powder coating—for a diverse range of electronic components. These include ESCs, HTCCs, LTCCs, MLCCs, AMB/DBC substrates, FPCBs, thick-film circuits/resistors, electronic ceramic substrates, silicon nitride substrates, ceramic green sheets, semiconductor wafers (including 12-inch wafers), wafer probe cards, SOFC cells, CGM biosensors, and thick-film heating elements. Possessing independent R&D capabilities and recognized as a "High-Tech Enterprise" and a "Specialized, Refined, Unique, and Innovative" (SRUI) enterprise, Xuanting provides customers with continuously innovative manufacturing processes, comprehensive printing line solutions, and superior technical support.
Microwave devices, ceramic packages
LTCC/HTCC/Microwave Dielectric Ceramic Components and Satellite Navigation Assemblies
Green ceramic tapes, metal pastes, ceramic packages, high-temperature co-fired ceramic (HTCC) heating elements, HTCC, LED ceramic substrates, ceramic metallization.
