Located in the High-tech Zone of Shanwei City, Guangdong Province, and covering an area of 14,000 square meters, Shanwei Suosi Electronic Packaging Materials Co., Ltd. is a national high-tech enterprise. The company offers integrated solutions for advanced packaging materials and operates two major production bases (in Shanwei and Hefei), utilizing three core processes and four proprietary, controllable technologies. It is the first domestic supplier to achieve full-process localization—spanning R&D and production—for advanced packaging materials. Since its inception, the company has prioritized technological innovation, focusing on the application of novel solders in fields such as high-reliability semiconductor packaging, microelectronics, and high-power optoelectronic packaging; it has secured numerous patents for inventions and utility models. Suosi Electronic’s main products include solder preforms, pre-applied Au-Sn lids, crystal oscillator lids, LTCC ceramic substrates, HTCC ceramic substrates, surface treatments (electroplated Ni/Au and electroless Ni/Au), package housing machining, and precision machining for scientific instruments.
