Zhengzhou Zhongke Institute of Integrated Circuit and System Application

Company Profile

Zhengzhou Zhongke Institute of Integrated Circuit and System Application was approved by the Zhengzhou municipal government in December 2019. Its advanced packaging (micro-assembly) production base began operation in December 2023. With 2,000 m² of Class 10,000 cleanroom and a solid team, it offers chip designers, research institutes and system makers one-stop services for ceramic-metal packaged microwave modules and sensors—from design support and prototyping to volume foundry and test/validation. The base has more than 70 pieces of process equipment covering electrical assembly, integrated assembly and welding, cleaning, eutectic attach, epoxy attach, bonding, sealing, test and screening. Capacity, measured on 8-channel Ku-band T/R modules, is 100,000 channels/year and can expand to 150,000. First-pass assembly yield is ≥92% and full-flow manufacturing yield is ≥98%. Flexible multi-chip stacked SiP packaging capacity is 20,000 sets/year.