Semiconductor Thermal Materials Forum
Semiconductor Materials Industry Forum
Semiconductor Thermal Management Materials Industry Forum
Diamond Materials, Semiconductor Thermoelectric Coolers (TEC)
August 27, 2026 | Hall 7, Shenzhen Bao'an Convention and Exhibition Center
Conference Background
With the rapid development of sectors such as artificial intelligence, AI computing power, high-performance computing, 5G/6G communications, and new energy vehicles, semiconductor devices are evolving toward higher power densities and greater integration; consequently, thermal management has emerged as a critical bottleneck limiting their performance, reliability, and lifespan. Addressing this formidable challenge requires innovation in and the application of advanced semiconductor thermal management materials, which have become key to achieving industry breakthroughs.
Diamond materials and Thermoelectric Coolers (TECs) are critical to overcoming current challenges in semiconductor thermal management:
1. Diamond materials: Possessing the highest thermal conductivity found in nature (exceeding 2,000 W/(m·K)), diamond is known as a "fourth-generation semiconductor material." Bonding diamond heat spreaders to GPU chips effectively lowers operating temperatures and stabilizes computing performance; additionally, diamond serves as a substrate or heat spreader material for Gallium Nitride (GaN) power devices. Integrating diamond with liquid-cooled microchannels enables an innovative thermal management paradigm that spans from material properties to structural design.
2. Thermoelectric Coolers (TECs): Utilizing the Peltier effect, TECs enable active, precise, and rapid solid-state temperature control. With the recent boom in optical communications, the demand for Micro TECs for heat dissipation in optical communication modules has surged, making them an indispensable solution for efficient thermal management in these modules. TECs also play an irreplaceable role in thermal management applications such as PCR temperature control for biochips, high-precision sensors, and automotive LiDAR. Enhancing thermoelectric conversion efficiency, alongside achieving miniaturization and array integration, is key to meeting the future thermal management needs of precision electronic equipment.
However, the transition of these advanced materials from the laboratory to large-scale commercial application still faces numerous challenges, including costs, manufacturing processes, reliability validation, and standardization. Against this backdrop, Aibang will host the 8th Precision Ceramics Industry Chain Exhibition from August 26 to 28 at Hall 7 of the Shenzhen World Exhibition & Convention Center (Bao'an New Venue). Held concurrently is a thematic forum on semiconductor thermal management materials, focusing on diamond-based thermal materials and thermal solutions involving thermoelectric cooler (TEC) materials. The event will bring together industry leaders, technical experts, and academic researchers to explore material breakthroughs, process innovations, integrated applications, and market prospects, thereby establishing a high-end platform for collaboration across industry, academia, research, application, and investment sectors.
Conference Agenda
No. | Presentation Topic | Invited Companies |
1 | Research on surface modification of diamond powder and the application of diamond-copper composites in semiconductor device thermal management | Prof. Wei Qiuping, School of Materials Science and Engineering, Central South University |
2 | Topic TBD | Ningbo Jingzuan Technology Co., Ltd. |
3 | Topic TBD | Xiancai (Shenzhen) Semiconductor Technology Co., Ltd. |
4 | Application of Micro-TECs (Thermoelectric Coolers) in optical modules | Liaoning Lengxin Semiconductor Technology Co., Ltd. |
5 | Topic TBD | Kesaida (Shanghai) Semiconductor Technology Co., Ltd. |
6 | Topic TBD | Zhongke Fenyan (Henan) Superhard Materials Co., Ltd. / Zhengzhou Institute of Abrasives & Grinding (ZZSM) |
7 | Application prospects of liquid cooling combined with diamond heat dissipation solutions in intelligent computing centers | Diamond substrate companies / Data center thermal management companies |
8 | MPCVD technology optimization: Uniformity control and defect suppression | Diamond substrate, material, and equipment companies |
9 | Advantages of aluminum nitride ceramic substrates for TEC heat dissipation | Ceramic TEC companies |
10 | TEC technology empowering thermal management in new energy vehicles | Ceramic TEC companies |
We are currently accepting proposals for additional topics. For inquiries regarding innovative speaking opportunities or sponsorship, please contact Ms. Li at 18823755657 (also her WeChat ID).
Registration Methods
Method 1: Register via WeChat by adding the contact and sending your business card.
Phone: Ms. Li – 18823755657 (WeChat enabled)
Email: lirongrong@aibang.com
Scan the QR code to add on WeChat and inquire about conference details.
Note: Each attendee is required to provide their information.
Method 2: Long-press the QR code to register online.
Alternatively, copy the link below into your browser to register via WeChat: