6th MLCC Industry Forum
The 6th MLCC Industry Forum
Invitation
August 27, 2026
Hall 7, Bao'an New Hall, Shenzhen World Exhibition & Convention Center
Conference Background
As indispensable passive components in electronic products, Multi-Layer Ceramic Capacitors (MLCCs) play vital roles in circuits—such as energy storage, filtering, bypassing, and decoupling. Thanks to advantages like compact size, high capacitance, excellent frequency characteristics, and a wide operating temperature range, they are widely used in fields including consumer electronics, automotive, AI servers, robotics, and low-altitude drones.

Often referred to as "industrial rice" due to their ubiquity, MLCCs have seen a surge in demand driven by sectors such as smart vehicles and AI servers. Currently, the high-end MLCC segment faces a situation where demand is rapidly outstripping supply; meanwhile, rising raw material costs have triggered a wave of price hikes. Against this backdrop, finding a way to break this impasse has become a shared goal for companies across the entire MLCC industry chain.

As the demand for MLCCs grows in downstream applications, specific requirements have emerged for the development of high-end MLCCs: miniaturization combined with high capacitance, high-temperature resistance, low ESR, and high SRF. Midstream MLCC manufacturers face corresponding technical challenges, highlighting the need for continuous optimization of passive components to meet the demands of the high-computing-power era; meanwhile, upstream raw material suppliers are required to provide finer, high-temperature-resistant ceramic powders.
Currently, the MLCC industry chain faces significant supply-demand gaps regarding high-end MLCCs and their key raw materials. Key challenges include high technical barriers for core raw material powders and a scarcity of manufacturers capable of stably producing fine-grade nano-nickel powder. Furthermore, challenges persist regarding auxiliary equipment (such as tape casting machines and sand mills) and consumables (such as MLCC release films), necessitating collaborative efforts among upstream and downstream enterprises and research institutions to elevate the MLCC industry chain to a higher level of development.
Against this backdrop, Aibang Smart Manufacturing will host the 6th MLCC Industry Forum—a concurrent event to the Aibang Precision Ceramics Exhibition—on August 27, 2026, at Hall 7 of the Shenzhen World Exhibition & Convention Center (Bao'an). Amidst a gathering of upstream and downstream industry players, the forum will focus on critical issues such as material bottlenecks for high-end MLCCs, supply-demand imbalances, and the surging demand driven by AI servers, robotics, and smart vehicles. By fostering collaboration across the supply chain to overcome technical hurdles, the event invites industry experts, corporate representatives, and researchers to explore new pathways for technological integration and discuss emerging opportunities for industry development.
Date & Venue
August 27, 2026 | Forum Area ②, 8th Aibang Precision Ceramics Exhibition
Proposed Topics
(Topics updated as of July 14)
No. | Proposed Topic | Invited Speaker |
1 | Additives for MLCC Applications | Dr. Hiroshi Yonehara, Head of R&D, BYK Additives (Shanghai) Co., Ltd. |
2 | Miniature, Ultra-thin MLCCs Enabling the Development of AI Chips and Advanced Packaging Technologies | Yuyang Technology |
3 | Precision Slurry Metering and Loss Optimization Mechanisms in MLCC Spiral Coating Technology | Shenzhen Zhongxinglian Technology Co., Ltd. |
4 | Research on the Application of Nano-Coulter Technology in MLCC Powder Characterization | Ma Xiaoting, Technical Director, Ruixin Zhizao (Shenzhen) Technology Co., Ltd. |
5 | Insights on Avoiding Common Pitfalls in High-End MLCC R&D | Fu Jionggui, General Manager, Guangzhou Shengli New Materials Co., Ltd. |
6 | Topic TBD | Hefei Hengli Equipment Co., Ltd. |
7 | Development Path for MLCC Miniaturization and High Capacitance | Invited: Dalian Dalicap Technology Co., Ltd. / Shenzhen Sunway Communication Co., Ltd. |
8 | Research on Controllable Preparation and High-Entropy Doping Modification of Nano-Barium Titanate Driven by High-End Electronic Material Demands | Professor Shi Liyi, Shanghai University |
9 | Topic TBD | Dr. Qi Shishun, Deputy Dean of Hongyuan Innovation Research Institute, Beijing Yuanliu Hongyuan Electronic Technology Co., Ltd. |
10 | Topic TBD | Dalian Overseas Huasheng |
11 | Ceramic Material Technologies for PME, BME, Pulse Energy Storage, and Microwave MLCCs | Professor Tang Bin, University of Electronic Science and Technology of China |
12 | Ultrafine Nano-Barium Titanate Powder Materials and Dispersion Evaluation Technology | Dr. Lu Wei, Technical Director, Huizhou Baoshunmei Technology Co., Ltd. / Researcher, Gusu Laboratory of Materials Science |
13 | Topic TBD | Shenzhen Jinminjiang Intelligent Equipment Co., Ltd. |
14 | Topic TBD | Maiborui |
15 | Topic TBD | Jiaxing Jingchi Special Ceramics Co., Ltd. |
16 | Topic TBD | Chongqing University |
More topics are being updated... | ||
We are currently soliciting more topics; recommendations or self-proposed topics are welcome. For speaking or sponsorship inquiries, please contact Ms. Li at 18124643204 (also WeChat).

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