Ceramic Substrate & Power Semiconductor Forum

Ceramic Substrate and Power Semiconductor Industry Forum

Invitation

August 26, 2026

Hall 7, Bao'an New Venue, Shenzhen World Exhibition & Convention Center

Conference Background

As strategic emerging industries—such as new energy vehicles, photovoltaic energy storage, industrial control, and rail transit—enter the stage of large-scale deployment, and as sectors ranging from 5G/6G communications to industrial automation and smart grid upgrades rapidly evolve, high-efficiency, reliable, and miniaturized power electronics technology has become a core pillar of support. Power semiconductors serve as the "heart" of electrical energy conversion, with their performance directly determining the efficiency and reliability of end products; consequently, the thermal conductivity of ceramic substrates and the reliability of packaging processes are the keys to overcoming the bottlenecks associated with achieving "high power, miniaturization, and long service life" in power semiconductors.

The application of microelectronic devices and third-generation semiconductors is currently trending toward high integration and high performance; however, the resulting surge in power density and heat generation severely limits device reliability and lifespan. Developing novel packaging materials that combine high thermal conductivity with excellent overall performance has become key to addressing this challenge. Thanks to their outstanding insulation, high thermal conductivity, coefficient of thermal expansion (CTE) matched to that of the chip, and excellent mechanical strength, ceramic substrates have become indispensable packaging materials for high-power, high-frequency, and high-temperature applications.

Ceramic material systems primarily include aluminum oxide, aluminum nitride, and silicon nitride. Among them, aluminum nitride has become the preferred choice for high-power LEDs, lasers, and IGBT modules due to its thermal conductivity, which far exceeds that of aluminum oxide; silicon nitride, combining high thermal conductivity with exceptional mechanical strength, is an ideal material for withstanding severe thermal cycling (such as in electric vehicle inverters).

Ceramic packaging provides hermetic protection for chips, creating a stable, long-term operating environment shielded from moisture and contaminants. While ceramic packaging offers superior performance compared to lower-cost plastic packaging, it comes at a higher price point; conversely, it holds a natural insulation advantage over metal packaging. Ceramic packaging faces new challenges as the industry demands cost reductions and efficiency gains alongside continuous advancements in plastic packaging technology. Its core competitiveness—and key to withstanding market pressures—lies in leveraging its inherent strengths (high-temperature resistance, high reliability, and excellent heat dissipation), accelerating technological innovation, and precisely targeting high-end electronic application niches.

Power semiconductors are central to the field of power electronics; as key components for energy conversion, they drive efficiency improvements across sectors such as new energy vehicles, photovoltaic energy storage, and smart home systems, performing functions that include power conversion, amplification, switching, and circuit protection. IGBTs and MOSFETs are the mainstream products, dominating the high-voltage and low-voltage segments, respectively. While silicon remains the dominant material, wide-bandgap materials like silicon carbide (SiC) and gallium nitride (GaN) are gradually gaining ground due to their superior properties, though next-generation SiC and GaN devices still face challenges such as material defects.

Image source: BYD Semiconductor

Power semiconductors are evolving toward higher power density, miniaturization, greater efficiency, and enhanced reliability, making advancements in chip and packaging technologies critical. Power module packaging requires the integration of components such as chips, ceramic substrates, and leads; the resulting surge in power density creates immense challenges regarding voltage drop management and heat dissipation. Traditional isolation technologies are approaching their performance limits under high-frequency, high-voltage conditions, thereby constraining overall system efficiency and safety.

The semiconductor power device sector encompasses the entire value chain, ranging from the supply of raw materials and equipment—such as wafers, lithography machines, lead frames, wide-bandgap materials, and other auxiliary supplies—to manufacturing stages like R&D, design, fabrication, and packaging and testing, as well as downstream application markets. Currently, collaboration across the upstream and downstream segments remains insufficient; overcoming these bottlenecks requires a concerted effort involving material innovation, technological advancement, and supply chain synergy.

Against this backdrop, achieving performance breakthroughs and ensuring the reliable application of power semiconductors relies heavily on the efficient thermal conductivity provided by ceramic substrates and the precision protection offered by ceramic packaging. On August 26, 2026, Aibang Smart Manufacturing will host the "Ceramic Packaging and Power Semiconductor Industry Forum" alongside the Aibang Precision Ceramics Exhibition at Hall 7 of the Shenzhen World Exhibition & Convention Center (Bao'an New Venue). Bringing together enterprises from across the industry supply chain, the forum will focus on topics such as ceramic materials, packaging processes, power semiconductor chips, and their applications. We cordially invite industry experts, corporate representatives, and researchers to join us in exploring new pathways for technological integration and discussing emerging opportunities for industry development.

Date and Venue

August 26, 2026; Forum Area ②, Aibang 8th Precision Ceramics Exhibition

Drafting the agenda

More topics are currently being solicited; recommendations or self-proposed topics are welcome.

For speaking or sponsorship inquiries, please contact: Ms. Li at 18124643204 (WeChat ID: same as mobile number).

Conference Registration

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https://www.aibang360.com/m/100308