6th LTCC/HTCC Industry Forum
The 6th LTCC/HTCC Industry Forum
Invitation
August 27, 2026
Hall 7, Shenzhen World Exhibition & Convention Center (Bao'an New Venue)
Conference Background
With the continuous advancement of electronic technology and the development of 5G millimeter-wave and future 6G systems, increasingly stringent demands are being placed on the performance and reliability of electronic components. Ceramic substrate technology—a critical material for integrated circuits (ICs) and microwave components—offers excellent electrical properties and mechanical strength; Low-Temperature Co-fired Ceramic (LTCC) and High-Temperature Co-fired Ceramic (HTCC) technologies represent the primary methods within this field.
△Source: Data Bridge Market Research
According to analysis by Data Bridge Market Research, the Low-Temperature Co-fired Ceramic (LTCC) and High-Temperature Co-fired Ceramic (HTCC) market is projected to grow at a CAGR of 5.10% during the 2022–2029 forecast period, reaching US$1,454.881 billion by 2029.
Low-Temperature Co-fired Ceramic (LTCC) technology enables the integration of multiple passive components—such as inductors and capacitors—through lamination and co-firing at temperatures between 850°C and 900°C, resulting in compact, high-density circuit components that are particularly well-suited for lightweight and thin consumer electronics. In recent years, the continuous emergence of new technologies has opened up fresh opportunities for the advancement of LTCC, including the development of novel copper-based LTCC material systems and the exploration of 3D printing techniques for LTCC.
High-Temperature Co-fired Ceramic (HTCC) is a type of multilayer integrated ceramic produced by using high-melting-point metal pastes—such as tungsten, molybdenum, or manganese—to screen-print circuit patterns onto the surfaces of ceramic green bodies (e.g., alumina or aluminum nitride), followed by high-temperature sintering (typically above 1200°C) to form three-dimensional circuits. This technology enables the fabrication of various HTCC ceramic products, passive and active integrated components, and functional modules. With the advancement of the field, HTCC ceramics have found widespread application in areas such as electronic packaging, heating equipment, automotive electronics, vacuum tube switches, integrated circuits, high-power electron tube packaging, and automotive sensors.
Drawn by promising market prospects, numerous domestic companies have positioned themselves in the R&D and manufacturing sectors of the HTCC industry; currently, HTCC application scenarios are expanding from traditional electronics into more high-end domains, driving a surge in demand. The LTCC and HTCC markets are significantly influenced by the booming automotive industry—particularly the rise of electric vehicles (EVs) and advanced driver-assistance systems (ADAS)—as well as the ongoing expansion of telecommunications infrastructure, emerging applications in medical technology, and the growing demand for miniaturization.
Against this backdrop, Ai bang Smart Manufacturing will host the 6th LTCC/HTCC Industry Forum—a concurrent event to the Ai bang Precision Ceramics Exhibition—on August 27, 2026, at Hall 7 of the Shenzhen World Exhibition & Convention Center (Bao'an). Set amidst a gathering of upstream and downstream industry players, the forum will focus on topics such as advancements in LTCC/HTCC technology, ceramic materials, electronic pastes, and sintering equipment upgrades. We cordially invite industry experts, corporate representatives, and researchers to join us in exploring new pathways for technological integration and discussing emerging opportunities for industry development.
Date and Venue
August 27, 2026 | Forum Area ①, Ai bang 8th Precision Ceramics Exhibition
Proposed Topics
(Topics updated as of July 16)
No. | Proposed Topic | Invited Guest/Speaker |
1 | Development of RF and sensor technologies and application trends in ceramic packaging | Zhou Jirui, Deputy Director of the Advanced Packaging and Testing Center, Zhengzhou Institute of Integrated Circuits and System Applications (CAS) |
2 | Discussion on key processes and equipment for multilayer co-fired ceramic (MLCC) sintering | Hefei Hengli Equipment Co., Ltd. |
3 | Discussion on ceramic packaging housing and substrate technologies for optical modules | Shao Jintao, Deputy Director, CETC No. 55 Research Institute |
4 | LTCC packaging technology | Liu Junyong, Expert, CETC No. 43 Research Institute |
5 | Topic TBD | Guangdao Laser |
6 | Topic TBD | Feiteer (Feiter) |
7 | Topic TBD | Hefei Hengli Equipment Co., Ltd. |
8 | AI-Enabled Cost Reduction and Efficiency Improvement in Ceramic Packaging Substrate Manufacturing for Chips | Yu Ruiyun, Professor at the School of Software and Director of the Office of Information Construction and Cybersecurity (Division-Director Level), Northeastern University |
9 | High-Reliability Copper-Based LTCC Packaging Solutions | Dou Zhanming, Deputy Chief Engineer, China Zhenhua Group Yunke Electronics Co., Ltd. |
More topics are currently being solicited; recommendations or self-proposed topics are welcome. For speaking or sponsorship inquiries, please contact Ms. Li at 18124643204 (also her WeChat ID).
Option 1: Please add us on WeChat and send your business card to register.
Phone: Ms. Li – 18823755657 (same number for WeChat)
Email: lirongrong@aibang.com
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