Semiconductor Ceramics Industry Forum
2026 Semiconductor Ceramics Industry Forum
Invitation
August 26, 2026
Hall 7, Shenzhen World Exhibition & Convention Center
Conference Background
Advanced ceramic components possess excellent properties such as high-temperature resistance, corrosion resistance, high precision, and high strength. They serve as parts for equipment including silicon wafer polishing machines, thermal processing systems (for epitaxy, oxidation, and diffusion), lithography systems, deposition equipment, semiconductor etching tools, and ion implanters. Semiconductor manufacturing requires a wide range of advanced ceramic components, such as electrostatic chucks (ESCs), ceramic heaters, vacuum chucks, focus rings, showerheads, chamber covers, viewing windows, nozzles, transfer arms, silicon carbide wafer boats, silicon carbide trays, probe cards, and ceramic bonding wedges.
As the global semiconductor market and spending on semiconductor manufacturing equipment continue to grow, the market for advanced ceramic components used in semiconductor equipment is also expanding. In particular, the recent growth of China's semiconductor industry and the ongoing localization of key equipment components have driven a rapid rise in demand for advanced ceramic components among downstream semiconductor enterprises. According to data from Frost & Sullivan, the global market for advanced structural ceramics in the broader semiconductor sector is projected to reach RMB 42.3 billion by 2026, with semiconductor and display panel equipment serving as the primary sources of demand—collectively accounting for over 80% of the total; the Chinese market for advanced structural ceramics for semiconductors is expected to reach RMB 12.5 billion by 2026.
Advanced ceramic components for the semiconductor industry are typically manufactured using high-purity, ultrafine inorganic materials—such as alumina, silicon carbide, aluminum nitride, and yttrium oxide. The production process involves several key stages: ceramic powder preparation, forming, high-temperature sintering, precision machining, quality inspection, and surface treatment. Serving as critical equipment components that come into direct contact with wafers during semiconductor processing, these parts are subject to rigorous technical standards. They must meet comprehensive performance requirements regarding mechanical, thermal, and dielectric properties, as well as resistance to acids, alkalis, and plasma corrosion; furthermore, they demand high dimensional precision and extremely strict control over surface metal ions and particles.
As my country's advanced ceramics industry started relatively late, the country still relies on imports for certain raw materials and lags behind leading global enterprises in the design and manufacturing of semiconductor ceramic components. Consequently, the market is currently dominated by foreign companies, presenting immense potential for import substitution. In recent years, domestic enterprises have made breakthroughs in key technologies, the industrial chain has matured, and the adoption and validation of locally produced advanced ceramic components have accelerated. To foster collaboration between upstream and downstream enterprises in this sector, Aibang Zhizao will host the Semiconductor Ceramics Industry Forum on August 26, 2026, at Hall 7 of the Shenzhen World Exhibition & Convention Center. We cordially invite industry professionals to join us in contributing to the localization of critical semiconductor ceramic components and seizing new development opportunities together.
Tentative Agenda
Forum Zone 2 | August 26, 10:00–16:00 | ||
No. | Presentation Topic | Speaker |
1 | Ceramic Materials and Components in Semiconductor Equipment | Professor Pan Wei, Tsinghua University |
2 | Electrostatic Chucks and Key Material Technologies | Professor Ying Guobing, Southeast University |
3 | R&D of Aluminum Nitride Ceramic Heaters and Their Application in CVD | Yu Dingxin, Senior Vice President, Guangdong Jingci New Materials Co., Ltd. |
4 | Application of Silicon Carbide Ceramics in Semiconductor Manufacturing Processes | Wang Ziteng, R&D Director, Shandong Guojing New Materials Co., Ltd. |
5 | Research on Dense, High-Strength, High-Modulus, Ultra-Low-Expansion Cordierite Ceramics | Professor Rao Pinggen, School of Materials Science and Engineering, South China University of Technology (Ph.D. Supervisor) |
6 | Low-Temperature, Medium-Pressure Plasma Jet Technology Enabling Self-Propagating Synthesis and Application of Silicon Nitride Powder | Liu Hongliang, Chairman, Shandong Zhonglin Semiconductor New Materials Co., Ltd. |
7 | Additives for Advanced Ceramics | R&D Director, BYK Additives (Shanghai) Co., Ltd. |
8 | Development of a Full Production Line for Precision Electrostatic Chuck Manufacturing and AI-Powered Inspection | Wu Gangxiang, Soochow University (Senior Engineer; Mentor for Senior Technology Managers in Suzhou) |
9 | Building Integrated Manufacturing Capabilities for Advanced Ceramics: From 3D Printing to Ultra-Precision Machining | Nie Pinxu, Business Development Manager (China), Sintokogio Advanced Ceramics |
10 | Topic TBD | Zibo Kehao Thermal Energy |
11 | Application of Photopolymerization (Light-Curing) Technology in Semiconductor Ceramic Materials and Components | Huang Zhifeng, Researcher, Wuhan University of Technology |
12 | TBD | Sanmo Institute (Zhengzhou Institute of Abrasives & Grinding) |
We welcome speaker recommendations or self-nominations. If interested, please contact Ms. Li at 18124643204 (also her WeChat ID).
How to Register
Option 1: Please add us on WeChat and send your business card to register.
Phone: Ms. Li – 18823755657 (same number for WeChat)
Email: lirongrong@aibang.com
Method 2: Long-press the QR code to register online
Alternatively, copy the URL to your browser to register via WeChat: