HTCC (High-Temperature Co-fired Ceramic): The Optimal Solution for High-End Optical Communication Packaging

As AI computing power networks undergo comprehensive upgrades, the optical communication industry has officially entered the era of high-speed 1.6Tb, 3.2Tb, and 6.4Tb technologies. This shift toward high speeds, massive bandwidth, and immense computing power brings critical industry challenges: soaring power consumption in optical modules, harsh operating environments, and doubled requirements for long-term reliability. HTCC (High-Temperature Co-fired Ceramic) represents the optimal solution for high-end optical communication packaging; thanks to its high thermal conductivity, hermetic sealing, superior stability, and wide operating temperature range, it has become an irreplaceable core substrate in this sector.

HTCC: Establishing an Irreplaceable Core Barrier in Optical Module Packaging

HTCC—or High-Temperature Co-fired Ceramic—utilizes a high-purity alumina ceramic substrate combined with circuitry made from high-melting-point metals such as tungsten and molybdenum. It is formed through a single-step firing process in a reducing atmosphere at temperatures exceeding 1,500°C.

For current high-speed optical modules, traditional metal housings, organic PCB substrates, and LTCC technologies fail to simultaneously meet stringent requirements such as hermeticity, high thermal tolerance, multi-layer integration, and long-term reliability. HTCC stands out as the only solution that comprehensively addresses these needs:

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  [ Monolithic Co-fired Hermeticity ] .

HTCC utilizes a monolithic co-firing process involving the lamination of green sheets; the structure is free of adhesives and seams, enabling 100% vacuum-tight hermetic packaging. It perfectly meets the hermeticity requirements of high-end devices like optical modules.

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  [ Matched Low-CTE Substrate ] .

Cijin Technology specializes in high-purity alumina HTCC systems, offering stable and consistent substrate performance ideally suited for high-speed optical modules. Its coefficient of thermal expansion (CTE) closely matches that of optical chips; this minimizes the risk of thermal stress-induced failure during long-term operation across wide temperature ranges, ensuring the stability of high-speed optical signals and RF transmission.

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  [ Essential Integrated Packaging ] .

Leveraging Cijin Technology’s proprietary HTCC high-temperature co-firing mass production lines, the technology enables flexible, precision 3D tungsten-molybdenum metallized routing across a range of 1 to 30 layers. It monolithically integrates signal, power, shielding, and thermal dissipation channels—eliminating the need for additional metal partitions and shortening signal paths to ensure high-frequency signal integrity.

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  [ Superior Thermal Management ] .

The HTCC alumina substrate offers thermal conductivity of 18–21 W/m·K. Large-area metallized heat sinks can be integrated into the bottom layer, while vertical thermal conduction channels connect directly to the chip pads, rapidly dissipating heat and effectively controlling the chip's junction temperature.

Source: Cijin Technology

Aibang has established an LTCC discussion group and cordially invites LTCC manufacturers, as well as equipment and material suppliers, to join. You are welcome to join the LTCC (Low-Temperature Co-fired Ceramic) industry WeChat group.

Recommended Event 1: [Invitation] The 6th LTCC/HTCC Industry Forum (August 27 · Shenzhen)

(Agenda updated as of July 10)

We are currently soliciting additional topics; recommendations or self-proposed topics are welcome. For speaking or sponsorship inquiries, please contact Ms. Li at 18124643204 (also her WeChat ID).

Recommended Event #2: Aibang’s 8th Precision Ceramics Industry Chain Exhibition [August 26–28, 2026 | Hall 7, Shenzhen World Exhibition & Convention Center (Bao'an New Venue)]

Booth Booking:

Ms. Wen: 18126443075 (also WeChat)

Email: wenxiaoting@aibang.com