Confirmed: A 13.5-Billion-Yuan Market—Ceramic Structural Components for Optical Modules See Explosive Growth
Amid the frenzy over AI computing power, the market has flocked to optical modules and optical chips, yet it has overlooked a "hidden gem" sector—ceramic structural components for optical modules—whose high-growth potential has been confirmed by institutional analysis.

Data from Cailian Press’s on-the-ground industry chain research—cross-verified and consistently cited by multiple industry intelligence agencies—indicates that the domestic market for ceramic structural components used in optical modules will reach RMB 13.5 billion by 2026, with ceramic substrates accounting for RMB 9.9 billion of that total. By 2027, the market is projected to surge to RMB 20–22 billion, representing an annual growth rate exceeding 60%. As a high-growth materials sector within the upstream computing power supply chain, the industry is poised for a simultaneous rise in both volume and price.
Constrained by raw material limitations and lengthy capacity expansion cycles, the production capacity for high-end Japanese ceramics continues to contract. This has widened the supply-demand gap, making the localization of supply chains an inevitable trend.
I. Authoritative Data Confirmed: A RMB 10-Billion-Plus Market by 2026,
Doubling in Size by 2027
The total market for optical module ceramic structural components is valued at RMB 13.5 billion for 2026; beyond the RMB 9.9 billion attributed to ceramic substrates, ancillary components—such as ceramic housings and TEC (Thermoelectric Cooler) heat-dissipation ceramics—account for RMB 3.6 billion. The industry is set to surge to RMB 20–22 billion by 2027, with a growth rate approaching 60%, marking it as a rare, high-certainty growth sector within the computing power landscape.
The core driver of this explosive growth is the significant increase in per-unit value resulting from the iteration of high-speed optical modules. Established patterns of technological evolution show that low-speed optical modules (400G and below) require only low-cost alumina ceramics, resulting in very low unit value. In contrast, 800G optical modules have fully transitioned to high-thermal-conductivity aluminum nitride ceramics, substantially increasing the value of ceramic consumables per module. For 1.6T optical modules, ceramic costs rise to 8%–12% of the total, unlocking a "double dividend" of increased shipment volumes and higher unit prices.

Fujian Huaqing Aluminum Nitride Ceramic Product Series
Unlike conventional materials, aluminum nitride (AlN) ceramics are an indispensable, irreplaceable material for high-speed optical modules. Their ultra-high thermal conductivity (170–230 W/mK) addresses the critical issue of overheating in 1.6T and 3.2T optical chips, ensuring long-term, stable equipment operation. Furthermore, their extremely low dielectric loss meets the demands of high-frequency, high-speed signal transmission and makes them the standard substrate material for next-generation Co-Packaged Optics (CPO) technology, underpinning solid industry demand.
II. Severe Supply-Side Imbalance: Japanese Production Capacity Constrained,
Opening a Window for Domestic Substitution
Behind the industry's rapid growth lies a long-standing structural supply-demand gap. The global market for high-end aluminum nitride powder and substrates has long been dominated by Japanese companies, which hold over 70% of the high-end market share. Two pivotal changes in the industry landscape in 2026 have fundamentally disrupted the status quo: first, the supply of key overseas raw materials has tightened, and Japanese manufacturers have voluntarily reduced production; second, the construction and process optimization of high-end ceramic production lines take over two years, meaning no new capacity will come online in the short term. These factors have directly led to significantly extended delivery times and steadily rising prices for high-end substrates, creating a supply shortage that is unlikely to reverse in the near future.
Stringent industry barriers have further raised the threshold for market entry. The ceramic sector for optical modules faces four formidable barriers: high-purity powder synthesis technology, micron-level precision tape casting and sintering processes, high-precision metallization and circuitry, and a lengthy 2–3 year customer certification cycle. Faced with these multiple hurdles, very few domestic companies possess the capability for mass-producing high-end 1.6T substrates; consequently, the industry exhibits a pronounced "Matthew effect," with leading enterprises continuing to reap the benefits.
To mitigate risks associated with overseas supply chains, downstream optical module manufacturers are actively initiating localization and certification processes to replace imported products. Domestic substitution has shifted from being "optional" to "essential," ushering in a golden era of growth for leading domestic players.

III. Three-Fold Growth Logic Secures Long-Term Prosperity
1. Continuous iteration of optical modules drives simultaneous growth in volume and price. The evolution from 800G to 3.2T modules consistently boosts the value of individual ceramic components; coupled with a projected doubling of high-speed optical module shipments between 2026 and 2027, the industry is poised for explosive, high-certainty growth.
2. CPO unlocks a second growth curve. As a core technology for next-generation computing power, the CPO architecture significantly increases the consumption of ceramic materials. With commercial adoption set to begin in 2027, this creates long-term growth potential; Fujian Huaqing has secured a first-mover advantage by proactively developing compatible products.
3. Vast potential for domestic substitution. The localization rate for high-end substrates remains low, and Japanese production capacity continues to face constraints. Leading domestic players can steadily capture 5%–10% of the overseas market share annually, representing billions in incremental growth driven by domestic substitution.
With an existing market value of RMB 13.5 billion and an incremental potential of RMB 22 billion, the "hidden" computing infrastructure sector of optical module ceramics has had its strong growth prospects confirmed by authoritative data. While the market currently focuses heavily on complete optical module units, the upstream core ceramic materials are undergoing a significant revaluation.
Source: Huaqing Longhu Semiconductor Industrial Park
Original Article: Confirmed RMB 13.5 Billion Market! Optical Module Ceramic Components Surge; Fujian Huaqing Positions Itself to Capture Domestic Substitution Dividends
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Recommended Event 1: [Concurrent Forum] Ceramic Substrate and Power Semiconductor Industry Forum (August 26 · Shenzhen)
(Agenda updated as of July 24)
Forum Session 3 | August 26, 10:00–16:40 | ||
No. | Presentation Topic | Speaker |
1 | Innovation in Embedded Packaging Technology Based on DAB Ceramic Substrates | Liu Heng, Head of Strategic Planning Department, Jiangsu Ferrotec Power Semiconductor Research Institute Co., Ltd. |
2 | Silver-Free AMB Copper-Clad Ceramic Substrates for High-Voltage Power Modules: Material Innovation and Reliability Research | Chen Tianhua, Deputy General Manager, Jiangsu Hansirui Semiconductor Technology Co., Ltd. |
3 | Application of Defect Detection in Precision Ceramic Manufacturing Processes | Liu Weisheng, Deputy General Manager, Shenzhen Hesizhongcheng Technology Co., Ltd. |
4 | Application of Precision Laser Processing and Welding Technologies in High-Reliability Power Device Packaging | Zhao Jiantao, General Manager, Zhejiang Zichen Laser Intelligent Equipment Co., Ltd. |
5 | Ammonolysis-Based Silicon Nitride Powder Project | Liu Zaixiang, General Manager, Qingdao Qiaohai Ceramic New Materials Technology Co., Ltd. |
6 | Key Technologies and Innovative Applications of DPC Ceramic Substrates for Advanced Packaging | Wu Zhaohui, General Manager, Jiangxi Jinghong New Material Technology Co., Ltd. |
7 | Pioneering Comprehensive Innovative Applications of High-Reliability Silicon Nitride Copper-Clad Ceramic Substrates in NEVs, PV Energy Storage, and Industrial Power Modules | Zhou Xin, General Manager, Nantong Wesper Semiconductor Technology Co., Ltd. |
8 | Seizing the Opportunity for Domestic Substitution: Mass Production Value and Application Prospects of 92% Alumina Ceramic Substrates | Pan Zimei, Engineer, Guangdong Ciyuanchuangxin Semiconductor Co., Ltd. |
9 | Application of PVD Technology to Ceramic Substrates for Packaging | Professor Xie Bin, University of Science and Technology of China (USTC) |
10 | Research Progress on IGBT Device Structures | Professor Zhang Jinping, University of Electronic Science and Technology of China (UESTC) |
11 | One-Stop Solutions for Aluminum Nitride Materials — Chengdu Xuci New Materials: Empowering High-End Manufacturing | Jiang Min, Deputy General Manager/Sales Director, Chengdu Xuci / Ningxia Beici |
12 | Application of Magnetron Sputtering for Deep-Hole Coating on Ceramic Substrates | Guangdong Huicheng Vacuum Technology Co., Ltd. |
13 | Industrialization and Application of High-Thermal-Conductivity Ceramic Substrates | Peng Xiang, Deputy General Manager/Chief Engineer, Yibin Hongxing Electronics Co., Ltd. |
14 | Topic TBD | Hunan Jinbo Carbon Co., Ltd. |
15 | Discussion on the Application of Silver-Coated Copper in Silver Pastes for Chip Interconnects | Professor Li Minggang, Central South University |
16 | High-Reliability DBA Substrates for SiC Chip Packaging | Liang Chao, Deputy General Manager, Jiangsu Borui Optoelectronics Co., Ltd. |
We are currently soliciting additional topics; recommendations or self-proposed topics are welcome. For speaking or sponsorship inquiries, please contact Ms. Li at 18124643204 (also her WeChat ID).
Recommended Event #2: Aibang’s 8th Precision Ceramics Industry Chain Exhibition [August 26–28, 2026 | Hall 7, Shenzhen World Exhibition & Convention Center (Bao'an New Venue)]

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