Dingci Electronics Completes New ¥250 Million Funding Round, Accelerating Localization of High-End Ceramics
Hebei Dingci Electronic Technology Co., Ltd., a domestic supplier of materials for high-end HTCC ceramic substrates, recently announced the completion of a new funding round totaling RMB 250 million. Investors participating in this round included SDIC Fund, CSC Capital, Nanjing Jucheng, and Yunhang Capital. The proceeds will primarily be used to upgrade high-end production lines, establish an R&D subsidiary platform, and achieve large-scale mass production of ceramic products for the civil semiconductor sector.
Founded in 2015, Dingci Electronics has long been deeply involved in the field of high-temperature co-fired ceramics (HTCC). It is one of the few domestic companies that has achieved independent R&D across the entire chain, from ceramic powder and metal paste to production equipment and manufacturing processes. Its products are widely used in high-growth sectors such as RF circuit SIP packaging, AI computing power packaging, high-speed optical modules, and precision semiconductor components, successfully breaking the long-standing monopoly of overseas companies in the field of high-end ceramic materials.
In June of this year, Dingci Electronics secured a capital injection of RMB 40 million from the Sichuan Guidance Fund. The proceeds from this round of financing will primarily be used to upgrade the company's high-end production lines, build an R&D platform for its Chengdu subsidiary, and commercialize its ceramic products for the civil semiconductor market.
Source: Hong'an Capital / Dingci Electronics — Dingci Electronics completes a new financing round of RMB 250 million, accelerating the localization of high-end ceramics.
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Forum Session 1 | August 27, 10:00–12:00 | ||
No. | Topic | Speaker |
1 | Development of RF and Sensor Technologies and Application Trends in Ceramic Packaging | Zhou Jirui, Deputy Director of the Advanced Packaging and Testing Center, Zhengzhou Institute of Integrated Circuits and Systems Application |
2 | Enabling Multilayer Co-firing: Key Technologies and Process Integration for HTCC/LTCC Sintering Equipment | Du Runsheng, Expert at CETC Group / R&D Director at Hefei Hengli |
3 | Discussion on Ceramic Packaging Housing and Substrate Technologies for Optical Modules | Shao Jintao, Deputy Director, CETC Institute No. 55 |
4 | LTCC Packaging Technology | Liu Junyong, Group Expert, CETC Institute No. 43 |
5 | Topic TBD | Guangdao Laser |
6 | New Progress in R&D and Processing of LTCC RF Devices | Wang Hongyang, General Manager, Shenzhen Feiteer Technology Co., Ltd. |
7 | AI-Enabled Cost Reduction and Efficiency Improvement in HTCC/LTCC Ceramic Packaging Substrate Manufacturing | Yu Ruiyun, Professor at the School of Software and Director of the Office of Information Construction and Cybersecurity (Division-Director Level), Northeastern University |
8 | High-Reliability Copper-Based LTCC Packaging Solutions | Dou Zhanming, Deputy Chief Engineer, China Zhenhua Group Yunke Electronics Co., Ltd. |
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