Yibin Hongxing Electronics: Mass production of 70-micron ultra-thin silicon nitride ceramic substrates achieved!

As chip packaging rapidly advances toward smaller sizes and higher levels of integration, ultra-thin ceramic substrates have become the "critical millimeter" that determines device performance and reliability.

Recently, the silicon nitride ceramic R&D team at Changhong Hongxing Electronics achieved a significant breakthrough: the mass production of "ready-to-fire" silicon nitride ceramic substrates with a thickness of just 70 micrometers. This achievement not only set a new domestic record for the mass-production thickness of ultra-thin silicon nitride substrates but also overcame the inherent brittleness challenges associated with ultra-thin ceramic substrate packaging by introducing a degree of flexibility.

01

Breaking the "Thinness" Barrier:

A Transformative Shift from Brittleness to Toughness

Once the thickness of silicon nitride ceramics drops to 0.1 mm, manufacturing complexity escalates exponentially. Traditional ultra-thin ceramic substrates are highly prone to micro-cracking and warping during the forming and sintering stages, resulting in extremely low yields.

The Changhong Hongxing Electronics team took a novel approach, leveraging a core technology matrix comprising precise crystalline phase control, optimization of ultra-fine powder slurries, and integrated forming-sintering synergy to successfully overcome the manufacturing curse of "thin yet fragile" materials. Test data shows that the substrates developed by Changhong Hongxing Electronics can withstand bending at angles up to 120° without fracturing—fundamentally overturning the conventional perception of ceramics as "hard and brittle." They achieve a stable flexural strength of 1200 MPa—far exceeding industry norms—and demonstrate vastly improved vibration and thermal shock resistance. With a thermal conductivity of ~85 W/m·K, they establish efficient heat dissipation pathways for high-power devices even in an ultra-thin form factor, truly achieving an ultimate balance: "light as a feather, tough as steel, and efficient at heat dissipation."

02

Eliminate grinding, achieve the result in one step:

"Instant-firing" technology reshapes cost and efficiency.

Conventional substrates require grinding to achieve reduced thickness, resulting in high material waste and manufacturing costs. Changhong Hongxing Electronics has innovatively adopted an integrated "form-and-fire" process that eliminates the grinding step; this significantly shortens the production workflow and boosts raw material utilization, offering customers a solution with superior overall cost-efficiency. The product is ideally suited for cutting-edge applications—such as AI computing chips, high-density energy storage converters, and RF modules—that demand lightweight designs, high integration, and exceptional reliability, thereby providing a high-performance substrate option for next-generation device packaging.

Source: Wei Changhong

Original Article: An Industry First! Changhong Hongxing Electronics Develops 70-Micron Silicon Nitride Substrate, Marking a Major Breakthrough in Domestic Packaging

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