Total investment of 2 billion yuan! Difeida's new high-density ceramic electronic substrate project breaks ground.
On July 3, the groundbreaking ceremony was held in the Nantong Development Zone for Difeida’s R&D, production, and sales base for new high-density ceramic electronic substrates—along with associated upstream and downstream projects—representing a total investment of 2 billion yuan.
Since its establishment in 1997, Jiangsu Difeida Group has achieved steady growth over nearly three decades, with operating revenue rising at an average annual rate of 20%. Recognized as a "Jiangsu Provincial Private Sci-Tech Enterprise," a "National 'Little Giant' Enterprise (Specialized, Refined, Differential, and Innovative)," and a "China CPCA National Brand Enterprise," the company has become a leader in the domestic printed circuit board (PCB) industry, boasting a strong reputation and immense growth potential.
The newly launched project by Jiangsu Difeida Electronics Nantong Co., Ltd.—comprising an R&D, production, and sales base for advanced high-density ceramic electronic substrates along with associated upstream and downstream facilities—involves a total investment of approximately RMB 2 billion. Upon completion and reaching full capacity, Phase I is projected to generate an annual output value of RMB 1.5 billion and annual tax contributions of RMB 100 million. The entire project is scheduled for completion by 2030 and full operation by 2031; once fully operational, it is expected to achieve an annual output value of RMB 4.5 billion and annual tax contributions of RMB 300 million.
Source: Nantong Economic and Technological Development Zone (National Level) — RMB 2 Billion Investment! Difeida Project Breaks Ground in the Zone
Aibang has established an industry exchange group for ceramic substrates; you are welcome to join! We invite you to join the WeChat group dedicated to the ceramic substrate and packaging industry.
Recommended Event 1: [Concurrent Forum] Ceramic Substrate and Power Semiconductor Industry Forum (August 26 · Shenzhen)
(Agenda updated as of July 3)
No. | Proposed Topic | Invited Guest/Speaker |
1 | Innovative Embedded Packaging Technology Based on DAB Ceramic Substrates | Liu Heng, Head of Strategic Planning Department, Jiangsu Ferrotec Power Semiconductor Research Institute Co., Ltd. |
2 | Silver-Free Active Metal Brazing (AMB) Copper-Clad Ceramic Substrates for High-Voltage Power Modules: Material Innovation and Reliability Study | Chen Tianhua, Deputy General Manager, Jiangsu Hansirui Semiconductor Technology Co., Ltd. |
3 | Application of Laser Precision Machining and Welding Processes in High-Reliability Power Device Packaging | Zhao Jiantao, General Manager, Zhejiang Zichen Laser Intelligent Equipment Co., Ltd. |
4 | Silicon Nitride Powder Project via Ammonolysis Method | Liu Zaixiang, General Manager, Qingdao Qiaohai Ceramic New Materials Technology Co., Ltd. |
5 | Key Technologies and Innovative Applications of DPC Ceramic Substrates for Advanced Packaging | Wu Zhaohui, General Manager, Jiangxi Jinghong New Material Technology Co., Ltd. |
6 | Leading the Comprehensive Innovative Application of High-Reliability Silicon Nitride Copper-Clad Substrates in New Energy Vehicles, PV Energy Storage, and Industrial Power Modules | Zhou Xin, General Manager, Nantong Wespir Semiconductor Technology Co., Ltd. |
7 | Positioning for Domestic Substitution: Mass Production Value and Application Prospects of 92% Alumina Ceramic Substrates | Pan Zimei, Engineer, Guangdong Ciyuan Chuangxin Semiconductor Co., Ltd. |
8 | Application of PVD Technology on Ceramic Substrates for Packaging | Xie Bin, Professor, University of Science and Technology of China (USTC) |
9 | Research Progress on the Structure of IGBT Devices | Zhang Jinping, Professor, University of Electronic Science and Technology of China (UESTC) |
10 | Application and Development of High-Performance Aluminum Nitride Ceramics | Wang Mingqing, Deputy Chief Engineer, Chengdu Xuci / Ningxia Beici |
11 | Application of Magnetron Sputtering Deep-Hole Coating on Ceramic Substrates | Guangdong Huicheng Vacuum Technology Co., Ltd. |
12 | Industrialization Progress and Applications of High-Thermal-Conductivity Ceramic Substrates | Peng Xiang, Deputy General Manager/Chief Engineer, Yibin Hongxing Electronics Co., Ltd. |
13 | Topic To Be Confirmed | Hunan Jinbo Carbon Co., Ltd. |
14 | Discussion on the Application of Silver-Coated Copper in Silver Paste for Chip Interconnection | Li Minggang, Professor, Central South University |
We are currently soliciting additional topics; recommendations or self-proposed topics are welcome. For speaking or sponsorship inquiries, please contact Ms. Li at 18124643204 (also her WeChat ID).
Recommended Event #2: Aibang’s 8th Precision Ceramics Industry Chain Exhibition [August 26–28, 2026 | Hall 7, Shenzhen World Exhibition & Convention Center (Bao'an New Venue)]
Booth Booking:
Ms. Wen: 18126443075 (also WeChat)
Email: wenxiaoting@aibang.com