Okamoto Glass Co., Ltd.: Mass production achieved for 200 W/m·K aluminum nitride substrates.
An aluminum nitride heat-dissipating substrate—jointly developed by Okamoto Glass Co., Ltd. and U-MAP Inc.—has achieved a thermal conductivity of 200 W/m·K; the product has passed mass-production certification by semiconductor substrate manufacturers, and initial shipments are set to commence.
Massive data processing in data centers generates significant heat in servers, making thermal management a critical industry challenge. To address this, the industry is accelerating the adoption of optical communication technologies (specifically optoelectronic integration) that replace electrical signals with optical signals. As lasers themselves are high-heat-generating components, the importance of laser submounts (ceramic heat-dissipating substrates) in ensuring their stable operation is rapidly increasing.
The aluminum nitride substrate that has now achieved mass-production certification boasts a thermal conductivity of up to 200 W/m·K and is primarily used as a carrier substrate for laser diodes (LDs) in data centers. Okamoto Glass Co., Ltd. is simultaneously advancing the development of products with a higher thermal conductivity of 230 W/m·K and ultra-thin (0.1 mm) heat-dissipating substrates, continuing to leverage its proprietary ceramic products to help the industry address various thermal management challenges.
Furthermore, to meet requirements for superior heat dissipation, samples of the 230 W/m·K thermal substrate and the 0.1 mm ultra-thin substrate are now available, and downstream customers are currently conducting preliminary product verification and evaluation.
Original link: https://www.nikkei.com/nkd/disclosure/tdnr/20260717595538/
Aibang has established an industry exchange group for ceramic substrates; you are welcome to join! We invite you to join the WeChat group dedicated to the ceramic substrate and packaging industry.
Recommended Event 1: [Concurrent Forum] Ceramic Substrate and Power Semiconductor Industry Forum (August 26 · Shenzhen)
(Agenda updated as of July 17)
Forum Session 3 | August 26, 10:00–16:40 | ||
No. | Presentation Topic | Speaker |
1 | Innovative Embedded Packaging Technology Based on DAB Ceramic Substrates | Liu Heng, Head of Strategic Planning Department, Jiangsu Ferrotec Power Semiconductor Research Institute Co., Ltd. |
2 | Silver-Free AMB Copper-Clad Ceramic Substrates for High-Voltage Power Modules: Material Innovation and Reliability Research | Chen Tianhua, Deputy General Manager, Jiangsu Hansirui Semiconductor Technology Co., Ltd. |
3 | Application of Defect Detection in Precision Ceramic Manufacturing Processes | Liu Weisheng, Deputy General Manager, Shenzhen Hesizhongcheng Technology Co., Ltd. |
4 | Application of Precision Laser Processing and Welding Technologies in High-Reliability Power Device Packaging | Zhao Jiantao, General Manager, Zhejiang Zichen Laser Intelligent Equipment Co., Ltd. |
5 | Ammonolysis-Based Silicon Nitride Powder Project | Liu Zaixiang, General Manager, Qingdao Qiaohai Ceramic New Materials Technology Co., Ltd. |
6 | Key Technologies and Innovative Applications of DPC Ceramic Substrates for Advanced Packaging | Wu Zhaohui, General Manager, Jiangxi Jinghong New Material Technology Co., Ltd. |
7 | Pioneering Comprehensive Innovative Applications of High-Reliability Silicon Nitride Copper-Clad Ceramic Substrates in New Energy Vehicles, PV Energy Storage, and Industrial Power Modules | Zhou Xin, General Manager, Nantong Wesper Semiconductor Technology Co., Ltd. |
8 | Positioning for Domestic Substitution: Mass Production Value and Application Prospects of 92% Alumina Ceramic Substrates | Pan Zimei, Engineer, Guangdong Ciyuan Chuangxin Semiconductor Co., Ltd. |
9 | Application of PVD Technology on Ceramic Substrates for Packaging | Xie Bin, Professor, University of Science and Technology of China (USTC) |
10 | Progress in Structural Research on IGBT Devices | Zhang Jinping, Professor, University of Electronic Science and Technology of China (UESTC) |
11 | Applications and Development of High-Performance Aluminum Nitride Ceramics | Wang Mingqing, Deputy Chief Engineer, Chengdu Xuci / Ningxia Beici |
12 | Application of Magnetron Sputtering for Deep-Hole Coating on Ceramic Substrates | Guangdong Huicheng Vacuum Technology Co., Ltd. |
13 | Industrialization and Application of High-Thermal-Conductivity Ceramic Substrates | Peng Xiang, Deputy General Manager/Chief Engineer, Yibin Hongxing Electronics Co., Ltd. |
14 | Topic TBD | Hunan Jinbo Carbon Co., Ltd. |
15 | Discussion on the Application of Silver-Coated Copper in Silver Pastes for Chip Interconnects | Li Minggang, Professor, Central South University |
16 | High-Reliability DBA Substrates for SiC Chip Packaging | Liang Chao, Deputy General Manager, Jiangsu Borui Optoelectronics Co., Ltd. |
We are currently soliciting additional topics; recommendations or self-proposed topics are welcome. For speaking or sponsorship inquiries, please contact Ms. Li at 18124643204 (also her WeChat ID).
Recommended Event 2: Aibang’s 8th Precision Ceramics Industry Chain Exhibition [August 26–28, 2026 | Hall 7, Shenzhen World Exhibition & Convention Center (Bao'an New Venue)]
Booth Booking:
Ms. Wen: 18126443075 (also WeChat)
Email: wenxiaoting@aibang.com