[Claim for Free for a Limited Time] 2026 Silicon Nitride Ceramic Substrate Report (PDF)
To all Aibang followers: We have updated our PDF report on silicon nitride ceramic substrates for 2026 and are sharing it with you for free. The report spans over 50 pages and comprises three chapters: an introduction to silicon nitride substrates (covering properties, manufacturing processes, applications, and market size), profiles of 34 domestic companies, and profiles of 8 international companies in the sector. To obtain the report, please scan the QR code below to contact the administrator and provide a screenshot showing that you have shared this article. If you are already in one of our groups, there is no need to join again; simply contact the administrator after sharing the post to receive the report.
Selected report contents:
Aibang has established a discussion group for ceramic substrates. You are welcome to scan the QR code below to follow the official account and apply to join via the "WeChat Group" option in the bottom menu.
Recommended Event 1: [Concurrent Forum] Ceramic Substrate and Power Semiconductor Industry Forum (August 26 · Shenzhen)
(Agenda updated as of July 24)
Forum Session 3 | August 26, 10:00–16:40 | ||
No. | Presentation Topic | Speaker |
1 | Innovation in Embedded Packaging Technology Based on DAB Ceramic Substrates | Liu Heng, Head of Strategic Planning Department, Jiangsu Ferrotec Power Semiconductor Research Institute Co., Ltd. |
2 | Silver-Free AMB (Active Metal Brazing) Copper-Clad Ceramic Substrates for High-Voltage Power Modules: Material Innovation and Reliability Research | Chen Tianhua, Deputy General Manager, Jiangsu Hansirui Semiconductor Technology Co., Ltd. |
3 | Application of Defect Detection in Precision Ceramic Manufacturing Processes | Liu Weisheng, Deputy General Manager, Shenzhen Hesizhongcheng Technology Co., Ltd. |
4 | Application of Precision Laser Processing and Welding Technologies in High-Reliability Power Device Packaging | Zhao Jiantao, General Manager, Zhejiang Zichen Laser Intelligent Equipment Co., Ltd. |
5 | Ammonolysis-Based Silicon Nitride Powder Project | Liu Zaixiang, General Manager, Qingdao Qiaohai Ceramic New Materials Technology Co., Ltd. |
6 | Key Technologies and Innovative Applications of DPC Ceramic Substrates for Advanced Packaging | Wu Zhaohui, General Manager, Jiangxi Jinghong New Material Technology Co., Ltd. |
7 | Pioneering Comprehensive Innovative Applications of High-Reliability Silicon Nitride Copper-Clad Ceramic Substrates in New Energy Vehicles, PV Energy Storage, and Industrial Power Modules | Zhou Xin, General Manager, Nantong Wesper Semiconductor Technology Co., Ltd. |
8 | Securing a Position in Domestic Substitution: Mass Production Value and Application Prospects of 92% Alumina Ceramic Substrates | Pan Zimei, Engineer, Guangdong Ciyuan Chuangxin Semiconductor Co., Ltd. |
9 | Application of PVD Technology to Ceramic Substrates for Packaging | Professor Xie Bin, University of Science and Technology of China (USTC) |
10 | Research Progress on the Structure of IGBT Devices | Professor Zhang Jinping, University of Electronic Science and Technology of China (UESTC) |
11 | One-Stop Solutions for Aluminum Nitride Materials — Chengdu Xuci New Materials: Empowering High-End Manufacturing | Jiang Min, Deputy General Manager/Sales Director, Chengdu Xuci / Ningxia Beici |
12 | Application of Magnetron Sputtering for Deep-Hole Coating on Ceramic Substrates | Guangdong Huicheng Vacuum Technology Co., Ltd. |
13 | Industrialization and Application of High-Thermal-Conductivity Ceramic Substrates | Peng Xiang, Deputy General Manager/Chief Engineer, Yibin Hongxing Electronics Co., Ltd. |
14 | Topic TBD | Hunan Jinbo Carbon Co., Ltd. |
15 | Discussion on the Application of Silver-Coated Copper in Silver Pastes for Chip Interconnects | Professor Li Minggang, Central South University |
16 | High-Reliability DBA Substrates for SiC Chip Packaging | Liang Chao, Deputy General Manager, Jiangsu Borui Optoelectronics Co., Ltd. |
We are currently soliciting more topics and welcome suggestions or proposals of your own. For speaking or sponsorship inquiries, please contact Ms. Li at 18124643204 (also her WeChat ID).
Recommended Event 2: Aibang’s 8th Precision Ceramics Industry Chain Exhibition [August 26–28, 2026 | Hall 7, Shenzhen World Exhibition & Convention Center (Bao'an New Venue)]
Booth Booking:
Ms. Wen: 18126443075 (also WeChat)
Email: wenxiaoting@aibang.com