Summary of 56 Domestic Ceramic Package Manufacturers

Ceramic Packages

Ceramic packages—also known as ceramic packaging housings—refer to packaging enclosures manufactured using ceramic materials. The production processes for these packages include HTCC (High-Temperature Co-fired Ceramic), LTCC (Low-Temperature Co-fired Ceramic), and DPC (Direct Plating Ceramic).

△ Multilayer ceramic package

△ DPC (Direct Plating Copper) Ceramic Technology

We have compiled a list of 56 domestic companies involved in ceramic packages/housings. The list below is in no particular order; if any companies have been omitted, please feel free to leave a comment and add them!

From August 26 to 28, companies such as CETC Institute 43, Chengdu Xuci/Ningxia Beici, Lu'an Hong'anxin Electronics, Zhuhai Xinci, Ciyuan Chuangxin, Fengce Electronics, Nanjing Yitai New Materials, Nanji Semiconductor, and Suosi Electronics will be exhibiting at the Shenzhen Precision Ceramics Exhibition. We welcome you to visit and network! For exhibition inquiries, please contact Ms. Li at 18823755657 (also her WeChat ID).

Hebei Zhongci Electronic Technology Co., Ltd.

Hebei Sinopack Electronic Technology Co., Ltd. (Stock Code: 003031), established in 2009 and affiliated with the 13th Research Institute of CETC, is a high-tech enterprise specializing in the R&D, production, and sales of electronic ceramic products. Committed to becoming a world-class supplier, the company provides customers with innovative, high-quality, and competitive electronic ceramic products. In the realm of ceramic packaging products, Sinopack is one of the few domestic manufacturers capable of competing with renowned international companies; it stands as a leading representative of my country's electronic ceramic packaging industry and holds significant influence within the sector.

Electronic Ceramics Business: The company’s portfolio includes electronic ceramic packages for communication devices, industrial lasers, and consumer electronics; ceramic substrates; automotive electronic components; and precision ceramic parts. These products are widely applied in fields such as optical communication, wireless communication, rail transit, industrial lasers, consumer electronics, low-carbon heating and cooling, automotive electronics, and semiconductor equipment.

The construction project for the consumer electronics ceramic package production line was completed and put into operation at the end of 2023. Additionally, an expansion project for a high-precision electronic ceramic production line—involving a total investment of RMB 343.5 million—is scheduled for December 2025; this project focuses on aluminum nitride (AlN) thin/thick-film substrates, electronic ceramic packages, and precision ceramic components.

Driven by the optical communications market, orders for ceramic packages—a critical component in optical module packaging—have increased. Sinopack Electronics has actively expanded production capacity to meet market demand and is supplying these products in volume. The transmission rates supported by its optical communication device packages span a wide range, including 2.5Gbps, 10Gbps, 25Gbps, 100Gbps, 200Gbps, 400Gbps, 800Gbps, 1.6Tbps, and 3.2Tbps.

Official Website: http://www.sinopack.com.cn/

CETC Institute 55

The 55th Research Institute of China Electronics Technology Group Corporation (CETC 55) was established in 1958 and currently operates under CETC. Its Packaging Division focuses on the technical research, product development, and commercialization of housings, substrates, and related products required for the packaging of microwave and millimeter-wave components, various semiconductor devices and modules, and integrated circuits.

The Packaging Business Unit has established a product portfolio spanning four major material categories—alumina, high-temperature co-fired ceramic (HTCC) based on aluminum nitride, low-temperature co-fired ceramic (LTCC), and glass-ceramic. It provides customers with products such as packaging housings (primarily for microwave and millimeter-wave applications), multilayer ceramic substrates, thin-film substrates, and passive components, alongside process services including plating and hermetic packaging.

The business division operates multiple production lines within a 16,000-square-meter facility; featuring advanced equipment and stable manufacturing processes, it possesses strong mass-production capabilities.

Official Website: http://www.cetc55.com

CETC Institute 43 / Shengda Technology

Established in 1968 and relocated to Hefei, Anhui, in 1982, the 43rd Institute of China Electronics Technology Group Corporation (CETC) is one of my country's earliest national-level research institutes dedicated to microelectronics technology and the country's only specialized institute focused on hybrid microelectronics.

It operates seven production lines covering thick-film hybrid integrated circuits, thin-film hybrid integrated circuits, multi-chip modules (LTCC), SMT circuit modules, metal packaging housings, thick-film hybrid integrated circuits for aerospace applications, and AlN ceramic materials.

Official Website: https://43.cetc.com.cn/43/335860/index.html

Hefei Shengda Electronic Technology Industrial Co., Ltd. (hereinafter referred to as "Shengda Technology"), affiliated with the 43rd Institute of CETC, is a high-tech enterprise specializing in the R&D of high-end packaging and electronic materials. Its product portfolio spans metal packaging, ceramic packaging, and packaging materials, and the company provides integrated solutions to meet comprehensive packaging requirements.

Shengda Technology operates R&D and production lines for products such as metal packaging housings, aluminum nitride (AlN) ceramic materials, and electronic pastes. Its products are widely used in civil sectors including optical communications, lasers, microwave technology, hybrid integrated circuits, power electronics, and advanced materials. The company currently boasts an annual output of over 3 million sets of metal packaging housings, with production capacities reaching 1 million DBC substrates (5"×7") per year, 4,000 square meters of AlN substrates per year, and 60 tons of electronic pastes per year. Serving customers across dozens of countries and regions worldwide, the company has earned a strong reputation both within and outside the industry for its comprehensive capabilities—spanning design, R&D, manufacturing, testing, and reliability assurance—as well as its mature, standardized management systems.

Construction of the electronic packaging material production base project began in March 2025, with the main structure fully topped out by June 2026.

Official Website: http://www.sdetec.com/

Chengdu Xuci / Ningxia Beici

Chengdu Xuci New Materials Co., Ltd. is located in Chengdu, Sichuan Province, and is a holding subsidiary of Chengdu Xuguang Electronics Co., Ltd. (600353). Ningxia Beici New Materials Technology Co., Ltd. is a wholly-owned subsidiary of Chengdu Xuci New Materials Co., Ltd.; located in Helan County, Ningxia, it occupies a production area of ​​14,000 square meters.

Key products include aluminum nitride (AlN) raw powder, fillers, granulated powder, ceramic substrates, structural components, and high-temperature co-fired ceramic (HTCC) devices. Regarding AlN HTCC products, the company has successfully developed proprietary raw material formulations and paste systems; pilot products have passed certification by select domestic and international customers, and the company has been added to the approved supplier lists of over ten clients, with volume shipments expected to commence before the end of the year.

The company currently operates workshops for powder, substrates, structural components, and HTCC products, featuring production lines with the following annual capacities: 500 tons of aluminum nitride powder; 4 million aluminum nitride substrates; 30 million aluminum nitride ceramic structural components; and 50,000 high-temperature co-fired aluminum nitride ceramic substrates.

Official Website: https://www.cdxuci.cn

Lu'an Hong'anxin Electronic Technology Co., Ltd.

Established in 2019, Lu'an Honganxin Electronic Technology Co., Ltd. is a subsidiary of Beijing Yuanliu Hongyuan Electronic Technology Co., Ltd. (Stock Code: 603267). The company is dedicated to the R&D and manufacturing of high-temperature co-fired ceramic (HTCC) multilayer substrates and ceramic packaging housings. It aims to provide customers with integrated solutions for micro-nano system integration and to establish a world-leading industrial base for electronic ceramics.

Lu'an Honganxin possesses fully independent intellectual property rights covering an entire R&D and manufacturing ecosystem—spanning from raw powders, green ceramic tapes, substrates, and housings to integrated packaging. It offers comprehensive solutions that encompass design, processing, packaging, testing, and verification. Its products are widely applied in fields such as monolithic integrated circuits, optoelectronic detection and optical communication, microwave communication modules, RF microsystems, optoelectronic microsystems, medical electronics, and automotive electronics.

Leveraging its technical expertise, Hong'anxin provides design and simulation services for ceramic packages—including housings, substrates, and lead frames. A pilot packaging production line has been established, meeting the development requirements for traditional micro-assembly processes used in microwave devices and modules.

In March 2023, the Lu'an Hong'anxin HTCC ceramic packaging component project achieved line commissioning.

Official Website: https://lahax.cn

Jiaxing Jiali Electronics Co., Ltd.

Jiaxing Jiali Electronics Co., Ltd. was established in December 1995 and specializes in the R&D, production, and sales of microwave dielectric ceramic components, as well as satellite navigation antennas, modules, and Bluetooth modules; its products are widely used in the fields of RF and microwave communication. A subsidiary of BDStar Navigation (002151), Jiali is one of the few domestic manufacturers possessing proprietary process technologies for both Low-Temperature Co-fired Ceramic (LTCC) and High-Temperature Co-fired Ceramic (HTCC) materials, and achieving large-scale manufacturing and application of these technologies.

In the field of HTCC (High-Temperature Co-fired Ceramic) technology, the company possesses capabilities for the R&D and mass production of HTCC devices, including ceramic packaging, insulating ceramics, and sensor ceramics. Its production capacities include over 2,000 tons of microwave dielectric ceramic materials and more than 300,000 high-performance ceramic substrates annually, alongside an annual output of 2.5 billion high- and low-temperature sintered microwave dielectric ceramic components, 50 million satellite navigation antennas, and 6 million satellite navigation modules.

Official Website: http://www.glead.com.cn

Hongming Electronics / Hongke Electronics

Established in April 1999, Chengdu Hongke Electronic Technology Co., Ltd. is a subsidiary of Chengdu Hongming Electronics Co., Ltd. (State-owned Factory 715; listed on the Shenzhen Stock Exchange on March 25, 2026). It is a high-tech enterprise specializing in the R&D and manufacturing of advanced electronic materials and components based on material science innovation. Its core business encompasses high-quality electronic ceramic materials and matching pastes, high-reliability multilayer ceramic capacitors (MLCCs), chip ceramic capacitors, Low-Temperature Co-fired Ceramic (LTCC) devices, ceramic packages for integrated circuits, temperature-compensating attenuators, and microwave device assemblies. The company’s ceramic packaging portfolio—including packages for integrated circuits, microwave and power devices, optocoupler-type hybrid integrated circuits, high-density applications, and custom designs—covers a wide range of standard package structures such as CSOP, CQFP, CDIP, CLCC, CQFN, and CLGA.

Construction of Hongke Electronics' new electronic components and integrated circuits production project began in December 2022. Centered on high-reliability integrated circuit packaging housings (HTCC), the project covers an area of ​​over 90 mu with a building area of ​​94,000 square meters. The total investment for Phase I is approximately 530 million yuan, and the facility is expected to be completed and put into operation in 2025.

Official Website: http://www.chinahongke.com/

Chaozhou Three-Circle (Group) Co., Ltd.

Chaozhou Three-Circle (Group) Co., Ltd. was established in 1970 and listed on the Shenzhen Stock Exchange in 2014 (Stock Code: 300408). On July 9, 2026, Three-Circle Group (06951.HK) officially listed on the Main Board of the Hong Kong Stock Exchange. With operations spanning Chaozhou, Shenzhen, Chengdu, Deyang, Nanchong, Suzhou, Wuhan, Hong Kong, Germany, and Thailand, the company is a comprehensive high-tech enterprise dedicated to the R&D, production, and sales of advanced materials.

The Electronic Packaging Division of Three-Circle Group was established in 2008. Leveraging its foundation in independent material R&D and technology, the Group became the first company in China to achieve mass production of ceramic packaging bases for semiconductors. To date, the division’s product portfolio encompasses crystal resonators, oscillators, tuning forks, SAW filters, sensors, CMOS components, RF ceramic packages, and optical transceiver modules, with products widely applied in fields such as telecommunications, smart devices, positioning systems, and automotive electronics.

In 2024, packages for 400G high-speed optical communication passed customer validation.

By 2026, new products—such as high-reliability ceramic packages designed specifically for optical chip packaging—had been launched on the market.

Official Website: https://www.cctc.cc/

Xiangci Keyi / Aisenda

Hunan Xiangci Science & Art Co., Ltd. was established through restructuring in 2000, evolving from the Hunan Provincial Ceramics Research Institute (founded in 1955). It is a high-tech enterprise group with a long history, integrating the R&D and production of advanced ceramic materials, product process and structural design, and technical services. Its subsidiaries include Ningxia Aisenda New Material Technology Co., Ltd. and Zhuzhou Xusen Technology Co., Ltd. The company primarily provides domestic and international clients with advanced ceramic materials, components, equipment, and system solutions, manufacturing products such as alumina ceramic vacuum tube housings, ceramic substrates, ceramic structural parts, ceramic electronic components, ceramic-to-metal brazed assemblies, and capacitor housings.

△CDIP陶瓷双列直插外壳

△ CQFP Ceramic Quad Flat Package

Official website: https://www.xcsa.com/product/16/

Zhuzhou Aisenda New Material Technology Co., Ltd. was established in March 2021 with the aim of becoming a leading enterprise in high-reliability electronic ceramic materials, driven by core technologies and significant industry influence. Its HTCC division operates a complete production line for HTCC products, featuring automation across multiple processes and an annual production capacity of 500,000 units.

The HTCC Business Unit specializes in products such as multilayer ceramic substrates, ceramic packaging housings, UV-LED lead frames, and various heating elements. These products serve a wide range of packaging sectors—including microwave devices, large-scale integrated circuits, hybrid integrated circuits, optoelectronic devices, LED chips, and semiconductors—utilizing materials primarily based on aluminum nitride and alumina. The division possesses advanced electronic packaging design capabilities and automated multilayer ceramic production facilities, backed by strong technical expertise and state-of-the-art processing equipment. It has developed over 200 product varieties across four major categories. Key in-house developments include alumina green tapes, tungsten metal pastes, and aluminum nitride green tapes produced from self-developed aluminum nitride powder.

Official Website: https://www.ascendus.com.cn

Zhuhai Xinci Precision Co., Ltd.

Zhuhai Xinci Precision Co., Ltd. is a domestic manufacturer specializing in precision ceramic circuit boards, dedicated to serving high-tech enterprises and research institutions both in China and abroad. Its core business encompasses four main product categories: DBC, DPC, and AMB ceramic substrates, alongside other types of ceramic substrates.

Zhuhai Xinchi DPC ceramic dam boards are suitable for applications in semiconductor packaging, automotive electronics, consumer electronics, and new energy.

Guangdong Ciyuan Chuangxin Semiconductor Co., Ltd.

Guangdong Ciyuanchuangxin Semiconductor Co., Ltd., established in August 2024, is a high-tech enterprise specializing in the R&D and manufacturing of high-performance electronic ceramic materials. Its core products—including HTCC/LTCC green tapes, electronic pastes, ceramic substrates, and packaging housings—are widely used in fields such as semiconductor packaging, optical communications, RF power devices, automotive sensors, and industrial electronics. The company's core technology originates from Professor Zhou Heping, a senior expert in electronic ceramics at Tsinghua University.

On October 12, 2025, the Phase I modern production base in Zhuhai, Guangdong Province, officially commenced trial operations. The facility encompasses key process steps such as the eco-friendly formulation and preparation of nano-alumina powder, sand-milling slurry production, tape casting, stamping, precision printing, wall coating, lamination, and HTCC (High-Temperature Co-fired Ceramic) sintering. It boasts a monthly production capacity of 300 kg for HTCC electronic pastes. Initial samples of metallized ceramic housings and substrates have been delivered, and the products are currently undergoing reliability testing and certification processes with several key customers.

Official Website: http://www.saiyingelec.com/

Shijiazhuang Fengce Electronic Technology Co., Ltd.

Shijiazhuang Fengce Electronic Technology Co., Ltd. was established in 2022. Its core team possesses over 20 years of experience in the semiconductor industry, with a primary strategic focus on ceramic substrate-based SiP (System-in-Package) packaging. The company specializes in the R&D and production of TCV ceramic thin-film processes and the advanced packaging of digital SiP modules.

TCV’s ceramic thin-film product portfolio includes DPC ceramic packages, ceramic thin-film filters and IPD filters, DPC heat sink substrates, and TCV ceramic multilayer carriers. Substrate materials include electronic ceramics such as alumina, aluminum nitride, silicon carbide, diamond, and HTCC. Metallization primarily utilizes the Ti-Cu-Ni-Au system, achieving trace precision of 10–15 μm and copper thicknesses of 1–75 μm; Ti-Pt-Au systems are also available upon request, and surfaces can be pre-deposited with Au-Sn (gold-tin) solder.

Nanjing Yitai New Materials Co., Ltd.

Nanjing Yitai New Materials Co., Ltd. is a high-tech enterprise integrating R&D, production, and sales. The company is located in Jiangning, Nanjing—a key national hub for scientific and technological innovation and a base for advanced manufacturing in Eastern China.

With over a decade of development and accumulated expertise, the company has assembled a top-tier domestic R&D team. It is dedicated to the design, development, and production of ceramic powders, high-temperature pastes, electroplating products, communication components, and various ceramic structural parts.

△芯片封装系列管壳

Key products include ceramic sensor elements, ceramic packaging housings, structural ceramics, ceramics for communications, and ceramic components for new energy applications.

Official website: http://www.njether.com/

Shanwei Suosi Electronic Packaging Materials Co., Ltd.

Shanwei Suosi Electronic Packaging Materials Co., Ltd. (established in 2014) is located in the High-tech Zone of Shanwei City, Guangdong Province. As a wholly-owned subsidiary of Guangdong Suoyibai Technology Co., Ltd., it is a National High-tech Enterprise featuring integrated solutions for advanced packaging materials, two major production bases (Shanwei Suosi and Hefei Suosi), three core processes, and four proprietary, controllable technologies.

Official Website: https://www.source-mat.com/products-myaa.html

Cijin Technology (Shenzhen) Co., Ltd.

Cijin Technology (Shenzhen) Co., Ltd. was established in April 2015. It is a high-tech enterprise specializing in the R&D, production, and sales of chip-style electronic components, leveraging new materials to provide comprehensive solutions for various chip packaging applications. In May 2026, the company completed its Series C financing, accelerating technological iteration and capacity expansion for core components such as ceramic packaging substrates.

The company focuses on electronic materials, electronic pastes, ceramic housings, ceramic substrates, ceramic metallization, mold design and development, automation design and development, metal and ceramic forming, surface treatment, and the design, production, and sales of various chip packaging housings. Its process capabilities span eight key areas, including paste formulation development, mold design, automation development, electrochemical surface treatment, and sintering.

The company operates two subsidiaries—Cijin Technology (Henan) Co., Ltd. and Cijin Technology (Guangdong) Co., Ltd.—specializing in the production of various specifications of PKG (packaging housings), Kovar rings, lids, and PFP (Plastic Flat Package) crystal oscillator components. It has successfully provided leading solutions across diverse sectors, including frequency control devices, optical communication components, filters, laser devices, CPUs, and sensors.

In 2023, Cijin Technology (Henan) Co., Ltd. launched an expansion project for semiconductor materials and packaging. The project involves the construction of production lines with an annual capacity of 1.2 billion packaging bases and 240 million nano-packaged crystal units. Plans are in place to deploy 8 to 10 intelligent production lines over the next three to five years, aiming to increase total annual production capacity to 12 billion units.

Official Website: http://www.cijinkj.com

Hebei Dingci Electronic Technology Co., Ltd.

Established in February 2015, Hebei Dingci Electronic Technology Co., Ltd. is a high-tech enterprise specializing in the R&D, production, sales, and technical services of electronic materials and components, electronic ceramics, and micro-assembly and micro-packaging technologies. Its flagship products include T/R module substrates for active phased array systems and ceramic bases (substrates) for RF sensors in civil communications, which are widely used in the fields of defense technology and high-end semiconductor sensors.

Dingci Electronics operates R&D and manufacturing bases in Shijiazhuang and Ningjin County, featuring production lines for multilayer ceramic packaging substrates and bases (housings) that rank among the best in China.

In June 2026, Hebei Dingci Electronic Technology Co., Ltd. secured a capital injection of RMB 40 million from a Sichuan government-backed guidance fund and, leveraging industry-academia-research resources from the University of Electronic Science and Technology of China, established a wholly-owned R&D subsidiary in Chengdu.

Jiangsu Gujia Intelligent Technology Co., Ltd.

Established in 2019, Jiangsu Gujia Intelligent Technology Co., Ltd. operates subsidiaries including Jiangsu Toubo Optoelectronic Technology Co., Ltd. and Zhongci Technology Hubei Co., Ltd. The company specializes in technical development and consulting for components such as fiber lasers, microwave devices, semiconductor packaging, and multilayer ceramic integrated circuits, while also providing comprehensive thermal management solutions, technical services, manufacturing, and sales. Through independent R&D, the company has developed technologies and products including lightweight copper-aluminum alloys, domestically produced DPC ceramic heat sinks, oxidation-free silver plating processes, DSC high-power sputtering, and microwave tube housing packaging. It provides professional thermal management products, high thermal conductivity technologies, and cost-reduction solutions to manufacturers of laser, microwave, and microelectronic devices.

The company operates nearly 300 CNC vertical machining centers and six brazing furnace production lines (comprising three mesh-belt tunnel furnaces and three dual-tube furnaces), as well as one fully automated cleaning line, five electroplating lines, one HTCC production line, and individual production lines for DPC, AMB, and DSC technologies. It is also equipped with several high-end precision measuring instruments, such as OMM and CMM systems.

2026 – Jiangsu Toubo Optoelectronic Technology: Achieved a technological breakthrough in 100G high-speed ceramic packages.

Official Website: http://www.jsgjzn.cn

Zhejiang Dongci Technology Co., Ltd.

Zhejiang Dongci Technology Co., Ltd. was formerly known as Zhejiang Changxing Electronic Factory Co., Ltd. Established in 2009, the company came under the holding of Jiangsu Dongchen in 2012. It specializes in the R&D, production, and sales of high-end ceramic and metal packaging housings for military-grade integrated circuits and discrete semiconductor devices, burn-in test sockets, high-end civil optical communication components, ceramic carriers, and electronic materials.

Dongci Technology is a leading domestic enterprise specializing in the R&D and manufacturing of ceramic packaging housings. The company possesses independent, controllable, end-to-end production lines for advanced ceramic packaging housings, as well as core technologies in product design and manufacturing processes—including formulations for powders and pastes, high-precision tape casting, high-temperature sintering, and nickel-gold plating. Its products serve a wide range of applications, including hybrid integrated circuits, optocouplers, solid-state relays, voltage regulators, diodes, transistors, rectifiers, amplifiers, and optical communication devices. These products are extensively used in sectors such as aerospace, aviation, marine engineering, critical national equipment, and various supporting products for consumer electronics.

Official Website: http://www.cxdzc.cn/

Jiangsu Yixing Electronic Components General Factory Co., Ltd.

Jiangsu Yixing Electronic Components General Factory Co., Ltd. was established in September 2017 through the restructuring of the former local state-owned enterprise, Jiangsu Yixing Electronic Components General Factory. Founded in 1969, the factory has long specialized in the research, development, and production of alumina multilayer ceramic packages; it achieved domestic breakthroughs by successfully developing—and subsequently mass-producing—DIP14 ceramic packages for integrated circuits and gold-tin alloy solder lids.

The company possesses comprehensive technical platforms for product design, manufacturing, and testing. Its product portfolio includes over 1,000 varieties of HTCC ceramic packages across more than 10 series—such as CDIP, CFP, CQFP, CLCC, CSOP, CPGA, and CLGA—as well as 500 varieties of gold-tin alloy solder lids. These products are widely used in the packaging of electronic components, including integrated circuits, solid-state relays, optocouplers, microwave devices, Hall-effect devices, power supplies, and MEMS. The company has an annual production capacity of 10 million HTCC ceramic packages and 10 million gold-tin alloy solder lids.

Construction of a 6-inch HTCC (High-Temperature Co-fired Ceramic) multilayer alumina package production line began in July 2013 and was completed in December 2013. The company successfully acquired Yixing Zhongshan Microelectronics Packaging Co., Ltd. in 2014 and successfully developed and mass-produced high-reliability SMD series packages in 2024.

Official Website: http://www.jsyxdzqj.com

Hefei Zhonghang Tiancheng Electronic Technology Co., Ltd.

Established in August 2017, Hefei AVIC Tiancheng Electronic Technology Co., Ltd. is a high-tech enterprise integrating R&D, production, and sales. The company is dedicated to providing global System-in-Package (SiP) customers with high-reliability packaging solutions for multi-chip modules and customized integrated packaging housings. It operates two wholly-owned subsidiaries—Suzhou AVIC Tiancheng Electronic Technology Co., Ltd. and Hefei Advanced Packaging Ceramics Co., Ltd.—and one holding company, Hefei Chunjun Material Technology Co., Ltd.

As of March 2023, the company has invested 100 million RMB in Phase I of its chip-level SOP system integration packaging project. With 12,000 square meters of R&D and production facilities, the project currently achieves an annual capacity of 3 million integrated packaging housings. According to the company's development plan, this capacity is projected to exceed 5 million units per year in 2024 and 8 million units per year in 2025.

Website: http://www.hfzhtc.com

Hefei Yifeng Electronic Packaging Co., Ltd.

Established in 2009, Hefei Yifeng Electronic Packaging Co., Ltd. is a national high-tech enterprise specializing in the R&D, production, and sales of metal and ceramic electronic packaging products. The company operates a comprehensive production line covering the entire process—from ceramic component processing and precision machining to sintering/sealing and surface treatment. It possesses end-to-end management capabilities spanning R&D, design, and manufacturing, as well as the expertise to design and produce miniature, lightweight housings. Furthermore, the company demonstrates mature and stable processing capabilities for challenging materials and techniques, including aluminum-silicon alloys, titanium alloys, ceramics, and selective plating.

The product portfolio includes housings for power supplies, hybrid integrated circuits, filters, transformers, semiconductor lasers, optical communication modules, and infrared detectors. The company supplies components to numerous major domestic research institutes and companies specializing in filters, laser devices, and optical communication components. In 2020, it established a ceramics R&D center and initiated the construction of an HTCC production line.

Official Website: http://www.hfyfdz.com

Xi'an Hangkexuangxing Electronic Technology Co., Ltd.

Established in 2019, Xi'an Hangke Chuangxing Electronic Technology Co., Ltd. is a high-tech enterprise specializing in the design, R&D, manufacturing, and testing of electronic ceramic packaging products for the semiconductor industry. The company is dedicated to achieving fully domestic, autonomous, and controllable capabilities across the entire value chain—from electronic ceramic materials (green tape and metal pastes) to LTCC and HTCC substrates and packages. It provides ceramic packaging solutions—including Multi-Chip Packaging (MCP), System-in-Package (SiP), and module-level packaging—to a diverse range of clients, including research institutes, universities, and chip design companies.

The company operates over 430 square meters of Class 10,000 cleanroom space and over 280 square meters of Class 100,000 cleanroom space. It is equipped with an advanced 8-inch ceramic production line, featuring mechanical and laser drilling machines, via-filling machines, printing machines, leveling machines, warm isostatic presses, and hot-cutting machines, alongside various tooling, molds, and testing equipment. The company possesses comprehensive technical capabilities spanning the entire value chain—from materials, process engineering, design, and production to simulation and testing.

In September 2023, the AeroInnoStar project was signed and established in Jinhua, Zhejiang.

Official Website: http://www.aeroinnostar.com

Nanji Semiconductor (Zhongshan) Co., Ltd.

Nanji Semiconductor (Zhongshan) Co., Ltd., located in Sanjiao Town, Zhongshan City, is a high-tech enterprise integrating R&D, design, and manufacturing, specializing in the production and sales of ceramic circuit substrates. Utilizing advanced DPC, DBC, and AMB processes, the company develops high-performance electronic material products based on premium raw materials such as alumina, aluminum nitride, zirconia, silicon carbide, silicon nitride, sapphire, diamond, quartz, glass, piezoelectric ceramics, ZTA-toughened ceramics, and 3D ceramics.

Official Website: https://njbdt88.com/sy

Guangdong Luhai Technology Co., Ltd.

Guangdong Luhai Technology Co., Ltd. (formerly known as Dongguan Luhai Technology Co., Ltd.) was established in 2020. Headquartered in Heyuan City, the company operates production bases in Humen and Shatian towns (Dongguan City) and Heyuan City, and maintains an office in Wuhan; it successfully completed its "Series A+" financing round in 2026.

Luhai Technology has long focused on the R&D and process innovation of semiconductor electronic ceramic materials—including HTCC and DPC advanced ceramic packaging, alumina, aluminum nitride, silicon nitride, diamond, and sapphire. The company has established a comprehensive industry chain spanning ceramic powders, ceramic housings, ceramic substrates, and ceramic packaging. It has achieved a breakthrough with a 26-layer HTCC process that has passed customer validation and is the first domestic enterprise to implement 3D circuit stacking technology for ceramics.

Shenzhen Honggang Optoelectronic Packaging Technology Co., Ltd.

Shenzhen Honggang Optoelectronic Packaging Technology Co., Ltd. was established in April 2002 with a registered capital of RMB 36,933,312. Its registered address is Unit 1, Building C, Room 101, Changfang Lighting Industrial Park, No. 6 Juliu Road, Zhukeng Community, Longtian Subdistrict, Pingshan District, Shenzhen. The company currently operates three major wholly-owned subsidiaries: Wuhan Honggang Electronic Technology Co., Ltd., Shijiazhuang Haike Electronic Technology Co., Ltd., and Shenzhen Honghai Technology Co., Ltd.

Honggang Packaging is a core upstream supplier in the new-generation information technology and optoelectronics industry chains. It possesses a comprehensive production chain and advanced manufacturing capabilities, ranging from precision machining, brazing, and glass (or ceramic) sealing to electroplating. The company operates over 400 units of CNC and auxiliary processing equipment, as well as 35 units of thermal processing equipment—including diffusion furnaces, debinding furnaces, oxidation furnaces, and continuous tunnel furnaces. It maintains six in-house production lines for nickel plating, gold plating, and selective plating, achieving an annual output of over 15 million metal packaging housings. Its products are widely used in high-end equipment manufacturing sectors such as lasers, optical communications, and consumer electronics.

Official Website: http://www.szhng.com/

Jiangsu Canqin Technology Co., Ltd.

Jiangsu Canqin Technology Co., Ltd. (Stock Code: 688182) was established in 2004 and listed on the STAR Market in 2021. The company specializes in the R&D, production, and sales of high-end, advanced electronic ceramic components. Its core product portfolio includes filters, resonators, and antennas, complemented by offerings such as low-PIM (passive intermodulation) passive components, metal-ceramic structural and functional components, and RF modules and systems. With thousands of product models available, the company’s products are widely used in sectors including mobile communications, radar and RF circuits, satellite communication/navigation/positioning, aerospace and defense, new energy, semiconductors, and the Internet of Everything (IoE).

Canqin Technology has established a complete automated production line for HTCC (High-Temperature Co-fired Ceramic) and developed end-to-end capabilities for its HTCC product line. The company handles all processes in-house, including product design, ceramic material preparation, body forming, sintering, surface metallization, brazing and assembly, testing and inspection, and experimental analysis. It has achieved cutting-edge process capabilities, including a minimum single-layer thickness of 0.1 mm, a minimum via diameter of 0.1 mm, and minimum line widths and spacings of 50 μm. The company has completed the development and sampling of various packaging products, such as microwave SiP, microwave power transistor packages, CMOS, optical communication components, optocoupler packages, CPGA, CBGA, CQFN, CLCC, CSOP, and CQFP. Some products have received customer approval and entered the small-batch delivery stage, while several ceramic substrate models have successfully completed small-batch delivery validation.

By July 2026, the company plans to utilize raised funds totaling no more than RMB 851 million to establish large-scale production capacity for 6G ceramic dielectric waveguide filters, conduct R&D on high-performance electronic ceramic devices, and expand HTCC production capacity.

Official Website: http://www.cai-qin.com

Guoci Materials / Guoci Saichuang

Guoci Saichuang Electric (Tongling) Co., Ltd. was established on May 17, 2017, and specializes in the R&D and manufacturing of high-performance ceramic substrates and heat sink materials; its core products are metallized ceramic electronic components. As a wholly-owned subsidiary of Shandong Guoci Functional Materials Co., Ltd., the company has recently achieved a technological breakthrough in the commercial aerospace sector: its RF microsystem chip packaging housings for communications—leveraging superior performance—have become the mainstream packaging solution for ceramic housings used in low-Earth orbit (LEO) satellites. Meanwhile, the construction of the company's Phase II facility has been completed, securing the production capacity needed to handle future volume orders.

△ Ceramic-Metal Packages

Wuhan Lizhida Technology Co., Ltd.

Wuhan Lizhida Technology Co., Ltd. is located in the Wuhan East Lake High-tech Development Zone ("Optics Valley of China"). It is a high-tech enterprise founded by university researchers with government support. Dedicated to the industrialization of academic research achievements, the company specializes in the R&D, production, and sales of ceramic substrate technologies for electronic packaging. It provides advanced packaging materials and technical solutions for sectors such as semiconductor lighting (LED), lasers and communications (LD & VCSEL), power electronics (MOSFET), thermoelectric cooling (TEC), high-temperature sensing (MEMS), and microwave/RF applications.

Official Website: http://www.lzdstar.com/

Jiangsu Huaici Technology Co., Ltd.

Founded in 2021 and headquartered in Hangzhou, Zhejiang, Huaici Technology is a national high-tech enterprise specializing in the R&D, production, and application of alumina, aluminum nitride, and HTCC (High-Temperature Co-fired Ceramic) electronic ceramic products. The company focuses on providing high-reliability ceramic packaging solutions for the electronic components industry. In June 2026, Huaici Technology completed its Series A+ financing round; the proceeds will primarily be used for the R&D of high-end ceramic packaging technologies, production capacity expansion, and market development.

In February 2023, the company established a subsidiary, Hangzhou Huaici Technology Co., Ltd., in Hangzhou to develop an industrialization project with an annual production capacity of 15 million sets of HTCC ceramic packaging substrates and housings. Huaici Technology’s product portfolio covers core ceramic components for various high-end sectors—including infrared detectors, optical communication housings, and RF device housings—with an annual shipment volume reaching 3 million units.

Huaici Technology offers a diverse range of HTCC ceramic package housing structures, including Ceramic Dual In-line Packages (CDIP), Ceramic Small Outline Packages (CSOP), Ceramic Leadless Chip Carriers (CLCC), Ceramic Quad Flat No-lead packages (CQFN), Ceramic Flat Packages (CFP/CQFP), and SOT89 packages. To date, the company has independently developed and manufactured over 200 product models across more than ten categories of ceramic housings (and substrates) for integrated circuit packaging—including high-temperature co-fired multilayer ceramic packages and SIP substrates—utilizing materials such as alumina and aluminum nitride.

Official Website: http://huaicitech.com/

Fujian Minhang Electronic Co., Ltd.

Fujian Minhang Electronics Co., Ltd., established on December 6, 2002, is a key enterprise in my country specializing in the R&D and manufacturing of ceramic packaging housings for integrated circuits. It serves as a national-level key industrial pilot base for high-density packaging of large-scale integrated circuits. As a leading manufacturer in the field, the company boasts advanced production equipment, strong development capabilities, and high product quality; it is capable of developing and producing nearly one hundred types of ceramic packaging housings across various series, including CLCC, CQFP, CQFJ, CPGA, CDFN, CQFN, CSOP, CDIP, CSIP, CFP, and MCM.

Minhang Electronics operates two complete production lines: one dedicated to research and development, and the other to mass production.

Official Website: http://www.minhang.com.cn

Fujian Nanping Sanjin Electronics Co., Ltd.

Established in 1997, Fujian Nanping Sanjin Electronics Co., Ltd. is a national high-tech enterprise, a national-level specialized, refined, distinctive, and innovative (SRDI) "Little Giant" enterprise, and home to the Fujian Provincial Engineering Technology Research Center for Ceramic Packaging Materials. The company specializes in the R&D and production of electronic ceramics, microelectronic packaging products, and integrated circuit chip packaging.

The IC packaging project was officially launched in 2017;

A production line for high-reliability black ceramic/low-melting-point glass IC packaging was established in 2018;

In 2020, the subsidiary Fujian Chuangxin Microelectronics Co., Ltd. was established. The company boasts first-class office facilities and modern R&D and production workshops. Its portfolio comprises five major series and nearly 300 product varieties—including integrated circuits—with an annual production capacity of 10 million units. Key products include black ceramic/low-temperature glass packaging housings (CERDIP and CFP types), which are utilized in aerospace, aviation, computing, automotive, and medical device sectors, as well as in microelectronic packaging applications requiring high reliability.

Official website: https://www.npsjdz.com

Due to space limitations, only the names of the following enterprises are listed.

• Qingdao Kairui Electronics Co., Ltd.

• Shanghai Xintaowei New Material Technology Co., Ltd.

• Shenzhen Huanbo Technology Co., Ltd.

• Zhejiang Shuangxin Microelectronics Technology Co., Ltd.

• AVIC Fuzida Technology Co., Ltd.

• Changchun Changguang Qichen Technology Co., Ltd.

• Rizhao Xuri Electronics Co., Ltd.

• Hefei Houkun Electronic Technology Co., Ltd.

• Linyi Ruikeda Optoelectronic Technology Co., Ltd.

• Shenzhen Xingxinlei Industrial Co., Ltd.

• Wuhan Youxin Technology Co., Ltd.

• Liaoning Shengshi Beici Electronic Technology Co., Ltd.

• Xiamen Haisaimike New Material Technology Co., Ltd.

• Huaci Electronic Technology (Henan) Co., Ltd.

• Shanghai Zefeng Semiconductor Technology Co., Ltd.

• Anhui Shangde Advanced Ceramics Co., Ltd.

• Suzhou Gaoxin Zhongke Semiconductor Co., Ltd.

• Shenzhen Sunlord Electronics Co., Ltd. / Guiyang Sunlord Xunda Electronics Co., Ltd.

• Beijing Huachuang Yousheng Electronics Co., Ltd. (Beijing 718 Yousheng Electronics Co., Ltd.)

• Shijiazhuang Thick-Film Integrated Circuit Factory

• Xi'an Taijin New Energy Technology Co., Ltd. / Xi'an Saier Electronic Materials Technology Co., Ltd.

• Ningbo Beilun Yingyunda Optoelectronic Technology Co., Ltd.

• Anhui Bowei Optoelectronic Technology Co., Ltd.

• Zhuhai Jinghua Electronic Technology Co., Ltd.

• Anhui Oupusi Technology Co., Ltd.

END

Aibang has established a WeChat group covering the entire ceramic packaging industry chain; companies from both upstream and downstream sectors are welcome to join by scanning the QR code. You are invited to join the ceramic substrate and packaging industry WeChat group.

Recommended Event 1: [Invitation] The 6th LTCC/HTCC Industry Forum (August 27 · Shenzhen)

We are currently soliciting additional topics; recommendations or self-proposed topics are welcome. For speaking or sponsorship inquiries, please contact Ms. Li at 18124643204 (also her WeChat ID).

Recommended Event #2: Aibang’s 8th Precision Ceramics Industry Chain Exhibition [August 26–28, 2026 | Hall 7, Shenzhen World Exhibition & Convention Center (Bao'an New Venue)]

Booth Booking:

Ms. Li: 18823755657 (also WeChat)

Email: lirongrong@aibang.com