Lianjie Technology Completes Tens of Millions of Yuan in Series A Financing, Focusing on Thin-Film Ceramic Substrates for Optical Modules
Recently, Suzhou Lianjie Technology Co., Ltd. (hereinafter referred to as "Lianjie Technology") secured a strategic investment amounting to tens of millions of yuan.
△ Image source: Qichacha
Lianjie Technology was established in January 2024. The company focuses on ceramic-to-metal bonding technologies, mastering core methods for metal-to-metal, glass-to-metal, and ceramic-to-metal sealing. It has achieved international standards in packaging materials, ceramic substrate technology, and ceramic-metal bonding technology.
Leveraging metal-ceramic bonding technology, the company has developed various ceramic components and metallized substrates for high-power chips. These products are widely used in fields such as optical communications, semiconductor lasers, semiconductor coolers, and smart grids. Product categories include aluminum nitride (AlN) ceramic substrates for optical modules—featuring metallization, gold-tin (AuSn) coatings, thin-film resistors, and via structures.
The thin-film ceramic substrates for optical modules are designed for high-speed applications (400G, 800G, 1.6T, etc.). The product portfolio also includes AMB ceramic substrates, DPC ceramic substrates, and DAC ceramic packages, with volume shipments already supplied to leading domestic and international enterprises.
Aibang has established a discussion group for ceramic substrates; you are welcome to join.
Recommended Event 1: [Concurrent Forum] Ceramic Substrate and Power Semiconductor Industry Forum (August 26 · Shenzhen)
(Agenda updated as of July 30)
Forum Session 3 | August 26, 10:00–16:40 | ||
No. | Presentation Topic | Speaker |
1 | Innovation in Embedded Packaging Technology Based on DAB Ceramic Substrates | Liu Heng, Head of Strategic Planning Department, Jiangsu Ferrotec Power Semiconductor Research Institute Co., Ltd. |
2 | Silver-Free AMB (Active Metal Brazing) Copper-Clad Ceramic Substrates for High-Voltage Power Modules: Material Innovation and Reliability Research | Chen Tianhua, Deputy General Manager, Jiangsu Hansirui Semiconductor Technology Co., Ltd. |
3 | Application of Defect Detection in Precision Ceramic Manufacturing Processes | Liu Weisheng, Deputy General Manager, Shenzhen Hesizhongcheng Technology Co., Ltd. |
4 | Application of Precision Laser Processing and Welding Technologies in High-Reliability Power Device Packaging | Zhao Jiantao, General Manager, Zhejiang Zichen Laser Intelligent Equipment Co., Ltd. |
5 | Ammonolysis-Based Silicon Nitride Powder Project | Liu Zaixiang, General Manager, Qingdao Qiaohai Ceramic New Materials Technology Co., Ltd. |
6 | Key Technologies and Innovative Applications of DPC Ceramic Substrates for Advanced Packaging | Wu Zhaohui, General Manager, Jiangxi Jinghong New Material Technology Co., Ltd. |
7 | Pioneering Comprehensive Innovative Applications of High-Reliability Silicon Nitride Copper-Clad Ceramic Substrates in New Energy Vehicles, PV Energy Storage, and Industrial Power Modules | Zhou Xin, General Manager, Nantong Wesper Semiconductor Technology Co., Ltd. |
8 | Securing a Position in Domestic Substitution: Mass Production Value and Application Prospects of 92% Alumina Ceramic Substrates | Pan Zimei, Engineer, Guangdong Ciyuan Chuangxin Semiconductor Co., Ltd. |
9 | Application of PVD Technology to Ceramic Substrates for Packaging | Professor Xie Bin, University of Science and Technology of China (USTC) |
10 | Research Progress on IGBT Device Structures | Professor Zhang Jinping, University of Electronic Science and Technology of China (UESTC) |
11 | One-Stop Solution for Aluminum Nitride Materials — Chengdu Xuci New Materials: Empowering High-End Manufacturing | Jiang Min, Deputy General Manager/Sales Director, Chengdu Xuci / Ningxia Beici |
12 | Application of Magnetron Sputtering for Deep-Hole Coating on Ceramic Substrates | Guangdong Huicheng Vacuum Technology Co., Ltd. |
13 | Industrialization and Application of High-Thermal-Conductivity Ceramic Substrates | Peng Xiang, Deputy General Manager/Chief Engineer, Yibin Hongxing Electronics Co., Ltd. |
14 | Topic TBD | Hunan Jinbo Carbon Co., Ltd. |
15 | Discussion on the Application of Silver-Coated Copper in Silver Pastes for Chip Interconnects | Professor Li Minggang, Central South University |
16 | High-Reliability DBA Substrates for SiC Chip Packaging | Liang Chao, Deputy General Manager, Jiangsu Borui Optoelectronics Co., Ltd. |
We are currently soliciting more topics and welcome suggestions or proposals of your own. For speaking or sponsorship inquiries, please contact Ms. Li at 18124643204 (also her WeChat ID).
Recommended Event 2: Aibang’s 8th Precision Ceramics Industry Chain Exhibition [August 26–28, 2026 | Hall 7, Shenzhen World Exhibition & Convention Center (Bao'an New Venue)]
Booth Booking
Ms. Li: 18124643204 (WeChat ID same as mobile number)
Ms. Wen: 18126443075 (WeChat ID same as mobile number)
Email: wenxiaoting@aibang.com