[Exhibitor Spotlight] Shoulei Laser: Providing One-Stop Laser Solutions

From August 26 to 28, 2026, Guangdong Shoule Laser Technology Co., Ltd. will participate in the 8th Aibang Precision Ceramic Industry Chain Exhibition (Booth No. G32). We warmly welcome industry colleagues to visit us and exchange ideas!

I. Company Profile

Guangdong Shoule Laser Technology Co., Ltd.

Shoulei Laser is a high-tech enterprise specializing in the R&D, manufacturing, and sales of high-end laser equipment. It operates three major R&D and manufacturing bases—located in Kunshan, Dongguan, and Changshu—with a combined total area of ​​50,000 square meters. (Dongguan Base: Guangdong Shoulei Laser Technology Co., Ltd., established in 2018; Kunshan Base: Suzhou Shoulei Laser Technology Co., Ltd., established in 2014; Changshu Base: Shoulei Laser Semiconductor Technology (Suzhou) Co., Ltd., established in 2021). The company also maintains sales and service offices in Chongqing, Hangzhou, Hefei, Nanchang, Xi'an, Huizhou, Xiamen, Vietnam, and other locations.

Shoulei Laser is dedicated to providing high-quality, comprehensive laser equipment solutions to global manufacturing clients. Its core products include laser welding machines, laser cutting machines, laser depaneling machines, laser marking machines, laser engraving machines, visual positioning and inspection systems, and customized automated laser equipment. These products are widely used across various sectors, including 3C electronics, new energy, electronic circuits, semiconductors, display panels, brittle materials, optical communications, automotive electronics, smart home appliances, medical devices, and aerospace.

II. Product Introduction

01 LCC/HTCC/LTCC Nanosecond/

Picosecond Laser Drilling and Cutting Machine

Product Advantages

◆ Dual-head laser processing system enabling simultaneous high-speed drilling using two galvanometer sets; single-head drilling speed exceeds 2,000 holes/hour, with continuously adjustable hole diameters ranging from 20 to 40 μm.

◆ Features fully automated loading and unloading, reducing labor costs and enhancing operational efficiency.

◆ Designed with adjustable relative positioning between suction cups to accommodate varying workpiece sizes, ensuring compatibility with both 6-inch and 8-inch substrates.

◆ Delivers stable operation and high processing precision, with accuracy better than ±5 μm.

Application Areas

Used in the display industry for the rapid processing of through-holes, blind vias, and cavities in materials such as LTCC green sheets and ferrites used in electronic components.

02 SiC/Si Laser Scribing Equipment

Product Advantages

◆ Modular and compact design; equipment dimensions: 1356 x 1432 x 1775 mm.

◆ Key laser processing station utilizes a high-precision work platform, delivering high speed and accuracy, with cutting precision better than ±20 μm.

◆ Employs a picosecond UV laser and cutting head for processing, ensuring stable power output and superior processing quality.

◆ Features high-precision CCD for automatic positioning and calibration.

◆ Proprietary processing software system offers ease of use and comprehensive functionality, facilitating customer customization of special features.

Application Areas

Designed for processing various ultra-hard materials; suitable for substrates used in semiconductor devices, such as sapphire, gallium nitride (GaN), and silicon carbide (SiC).

03 CO₂ Ceramic Cutting Machine

Product Advantages

◆ Compatible with automated robotic arms for loading and unloading, ensuring high processing efficiency.

◆ Features vacuum-based workpiece clamping and vision-guided positioning for high positional accuracy.

◆ Utilizes a high-beam-quality laser source, resulting in narrow cutting kerfs and smooth hole walls.

◆ Equipped with a high-precision linear motor platform, offering both high accuracy and high speed.

◆ Employs a non-contact processing method, eliminating mechanical stress and deformation.

Application Areas

The CO2 ceramic cutting machine is primarily used for the precision cutting, scribing, and drilling of hard, brittle non-metallic materials—such as alumina, aluminum nitride, zirconia, and ceramic circuit boards—across industries including electronic circuitry, aerospace, and automotive electronics.

04 Fiber Laser Ceramic Cutting Machine

Product Advantages

◆ Equipped with linear motors and a marble platform, ensuring high operating speeds and precision.

◆ Wide adjustable range for drilling diameters; drilling efficiency exceeds 10 holes per second.

◆ Supports various visual positioning features, such as crosshairs, solid circles, hollow circles, L-shaped corners, and image feature points.

◆ Drilled hole circularity >85%.

◆ Drilling taper <15μm.

Application Areas

Suitable for passive components, thick/thin-film circuit substrates, LED (packaging) lead frames, and ceramic or metal (e.g., stainless steel) components for smart devices such as mobile phones and smartbands.

Recommended Event 1: Aibang’s 8th Precision Ceramics Industry Chain Exhibition [August 26–28, 2026 | Hall 7, Shenzhen World Exhibition & Convention Center (Bao'an New Venue)]

Booth Booking

Ms. Li: 18823755657 (WeChat ID)

Email: lirongrong@aibang.com

Scan the QR code to add on WeChat and inquire about exhibition details.

Recommended Event 2: 9 Concurrent Forums

How to register as an attendee:

Scan the QR code or copy the link to register.

https://www.aibang360.com/sign/100085