The 8th Aibang Ceramics Exhibition Concludes Successfully | Leveraging the Exhibition as a Platform to Discuss New Opportunities in Semiconductor Ceramic Packaging – Shijiazhuang Fengce Electronics

The 7th Aibang Ceramics Exhibition has concluded successfully. We extend our sincere gratitude to all the new and existing customers and industry colleagues who visited our booth to engage in discussions and exchanges.

At the exhibition, we engaged in in-depth technical dialogues with partners across the industry regarding our core product solutions—including HTCC (High-Temperature Co-fired Ceramic) packages and substrates, DPC substrates/packages/heat sinks, TVC multilayer ceramic carriers, IPD filters, and advanced packaging technologies. We listened closely to real-world industry needs and gained a wealth of valuable suggestions and partnership opportunities.

At this exhibition, Shijiazhuang Fengce Electronic Technology showcased products and technologies including HTCC (High-Temperature Co-fired Ceramic) packages, HTCC ceramic substrates, DPC (Direct Plated Copper) ceramic substrates/packages/heat sinks, TVC multilayer ceramic carriers, IPD filters, and advanced packaging solutions.

HTCC Ceramic Package Series

HTCC Ceramic Substrate RDL

DPC Ceramic Substrates, Packages, and Heat Sinks

TVC Ceramic Multilayer Substrate

IPD Filter

Advanced packaging capabilities

     This brief encounter marks a fresh starting point for our collaboration. Following the exhibition, we will systematically review all discussions and follow up on potential partnership opportunities. We remain committed to deepening our presence in the semiconductor ceramic packaging sector, refining product performance, and optimizing technical services to deliver stable, reliable packaging solutions to our customers.

We are grateful for the opportunity to meet you and look forward to joining forces in the future to create shared value within the industry.