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Gangfeng Abrasives: A specialized supplier of precision abrasive tools for the drilling, cutting, milling, grinding, and polishing of technical ceramics.

2026-08-25 News 125

From August 26 to 28, 2026, Shenzhen Gangfeng Abrasives Co., Ltd. will participate in the 8th Aibang Precision Ceramic Industry Chain Exhibition (Booth No. H12). We warmly welcome industry colleagues to visit us and exchange ideas!

01

Company Profile

Established in July 2003, Gangfeng Abrasives specializes in the R&D and manufacturing of superhard abrasive tools. With production facilities located in Shenzhen and Huizhou covering a total area of ​​approximately 6,000 square meters, the company boasts a top-tier, pragmatic engineering team and utilizes high-precision automated CNC machinery, large-scale thermal processing equipment, and extensive precision electroplating systems. Critical inspection processes employ instruments sourced from the United States, Germany, and Japan. The product portfolio encompasses vitrified bond, metal bond (sintered/bronze bond), resin bond, electroplated, and brazed diamond and CBN (Cubic Boron Nitride) abrasive tools, with the capability to manufacture over a thousand varieties of tools for cutting, grinding, and polishing applications.

With over two decades of experience integrating the manufacturing and market application of super-hard abrasive tools, Gangfeng has—through dedicated in-house R&D and ongoing technical collaboration with international industry peers—developed products widely used across sectors such as electronic glass, ceramics, sapphire, semiconductors, precision optics, hardware tools, magnetic materials, automotive manufacturing, photovoltaics, and architectural grinding wheels. Having earned widespread customer recognition as an emerging domestic enterprise specializing in technology R&D, the company is rapidly becoming a leading brand in China’s abrasives industry. Gangfeng remains committed to talent development, product innovation, and equipment upgrades, striving to lead the industry in technological advancement.

02

Product Overview

Electroplated Diamond Tools

Glass Cover Series

  • Ceramic Sapphire Series

  • TFT Series

    Hole enlarging, chamfering, radiusing, etc.

  • Protective Sheet Series

    Processing includes hole punching, hole enlarging, edge chamfering, and rounding of edges.

  • Grinding Alloys and Optical Glass Series

    Grinding alloy materials, tungsten steel cutting tools, optical lenses, etc.

  • Special-Shaped File Series

    For processing liquid metal and mobile phone hinges, deburring irregularly shaped metal parts, etc.

  • Knife Sharpener Series

    For processing cutlery, kitchenware, and outdoor gear, as well as DIY sharpening and maintenance of outdoor knives and tools.

  • Various Custom-Made Non-Standard Series

Brazed Diamond Tools (Single-layer Sintered)

  • Brazed Grinding Wheels

Grinding wheels and drilling/cutting tools for cast iron, stone, and ceramics.

  • Specialized Brazed Grinding Wheel for Carbide

    For carbide cutting tools.

  • Brazed Profiled Grinding Wheels

    Suitable for grinding workpieces with high-hardness thermal spray coatings, as well as high-strength, difficult-to-grind metals.

  • Brazed Tool for Sapphire Roughing and Shaping

    Suitable for the roughing and shaping of sapphire glass; replaces traditional manual milling and grinding, offering high yield rates and long service life.

  • Brazed Grinding Bits for Ceramic Back Cover Machining

    Designed for heavy-depth machining as well as semi-finishing and finishing of ultra-hard ceramic back covers; offers a service life significantly exceeding that of electroplated tools.

  • Brazed grinding heads for alumina ceramics

    Suitable for machining high-hardness alumina workpieces.

  • Long-diameter rods for home appliance glass and crystal products

    Suitable for various glass drilling, reaming, and edge-grinding applications; features long service life and high concentricity, with no abrasive shedding.

  • Brazed Grinding Bits for Mobile Phone Front and Back Covers

    Suitable for drilling, precision shaping, and contour restoration.

  • Brazed Ultra-Fine Grit Grinding Rods

    Suitable for precision processing of high-hardness glass; available in grit sizes up to #1000.

Metal-bonded diamond grinding wheel

  • TFT-LCD edge-grinding wheel / Multi-groove wheel for ITO conductive film glass

  • Automotive Glass Edging Wheel

    Suitable for edge grinding of automotive windshields and tempered glass products.

  • Automotive Glass Drill Bits

    Designed for drilling holes in rear windshields, side windows, and sunroofs; available in integrated and two-piece designs.

  • Mobile Phone Back Cover Thinning Wheel

    Suitable for the cold grinding and thinning of glass back covers.

  • Metal-bonded Sintered Grinding Discs

    Suitable for the chamfering and precision finishing of optical glass, sapphire, and crystal products.

  • Metal-bond cutting discs

    Suitable for glass tubes, e-cigarette tubes, and quartz glass.

  • Metal-Bond Semiconductor Dicing

    Suitable for precision dicing in semiconductor packaging (QFN, PQFN, PCB, BGA, CSP).

  • Sapphire Core Drill

    Suitable for core drilling sapphire boules.

  • Metal-Bond Grinding Wheels

    We manufacture wheels ranging from a maximum diameter of 500mm down to a minimum of 0.5mm. We welcome inquiries and orders based on your specifications or drawings.

  • Drilling Silicon Carbide Ceramics

    Drilling of ultra-hard ceramics such as silicon carbide and silicon nitride.

  • Metal cutting discs for ceramic materials

    Suitable for cutting ultra-hard ceramic materials.

  • Metal-sintered milling and grinding wheel

    Suitable for milling and grinding sapphire and ceramics.

  • Metal-bonded Sintered Grinding Bur for Ceramics

    Suitable for machining the internal cavities of ceramics.

Resin-Bonded Diamond/CBN Grinding Wheels

  • Peripheral Grinding Wheels for Inserts

Suitable for the peripheral indexing grinding of inserts.

  • Diamond Grinding Disc

    Suitable for chamfering materials such as glass, ceramics, and sapphire; it can also be used to fabricate double-sided grinding wheels for thinning and polishing applications.

  • Resin Dicing Blades

    Suitable for precision dicing in semiconductor packaging (QFN, POFN, PCB, BGA, CSP).

  • Resin-Bonded Cutting of Optical Glass

    Suitable for cutting K9 glass, coated glass, specialty glass, and glass components.

  • Ceramic Polishing Grinding Bits

    Suitable for the precision polishing of ceramic perimeters and internal cavities.

  • Resin Grinding Bit for Mark Removal

    Suitable for removing grinding marks left after rough carving on sapphire and glass.

  • Specialized Tools for Semiconductor Manufacturing Equipment

    Diamond machining tools used in semiconductor manufacturing equipment for processing materials such as quartz, ceramics, and silicon.

  • Diamond Tools for Monocrystalline Silicon

    Used for processing semiconductor equipment and monocrystalline silicon components.

  • Quartz Diamond Tools

    Used for processing quartz slots, quartz rings, quartz flanges, and quartz reaction vessels for semiconductor equipment.

  • Diamond Tools for Aluminum Nitride

    For machining and polishing aluminum nitride.

  • Diamond Tools for Silicon Carbide

Cutting tools used for processing ultra-high-purity silicon carbide.