Ceramic-Metal Packaged Microwave Components / Sensor Products | Zhengzhou Zhongke Integrated Research Institute offers one-stop services covering design, contract manufacturing, and inspection.
From August 26 to 28, 2026, the Zhengzhou CAS Institute of Integrated Circuits and System Applications will participate in the 8th Precision Ceramics Industry Chain Exhibition (Booth No. D43). We warmly welcome industry colleagues to visit us and exchange ideas!
I. Company Profile
Zhengzhou CAS Institute of Integrated Circuits and System Applications
Established in December 2019 with the approval of the Zhengzhou Municipal Government, the Zhengzhou Institute of Integrated Circuits and System Applications (ZICSA) launched its advanced packaging (micro-assembly) production base in December 2023. Featuring a 2,000-square-meter Class 10,000 cleanroom and a highly skilled workforce, the institute provides one-stop services—ranging from assisted design and prototype fabrication to mass contract manufacturing and testing/verification—for chip design companies, research institutes, and system manufacturers. Its offerings include ceramic-metal packaged microwave components and sensor products.
The advanced packaging (micro-assembly) production base is equipped with over 70 sets of key machinery and instruments covering the entire process flow—including electrical assembly, integrated assembly and soldering, cleaning, eutectic soldering, epoxy die bonding, wire bonding, sealing/welding, testing, and screening—thereby meeting the requirements for independent production. In terms of capacity, the base supports an output of 100,000 channels per year (based on 8-channel Ku-band T/R module standards), with scalability to 150,000 channels annually. It achieves a first-pass assembly yield of ≥92% and an overall manufacturing yield of ≥98%, alongside an annual production capacity of 20,000 units for flexible SiP multi-chip stacked packages.
Business scope includes:
Invitation for Collaboration:
Product Application Collaboration: Facilitating the practical application of products—such as microwave components, power amplifiers, MEMS sensors, and SiP modules—in sectors including communications equipment, radar, and intelligent hardware.
Contract Packaging Services: Providing design and manufacturing enterprises with end-to-end contract services—ranging from package structure design, die attach, and wire bonding to hermetic/non-hermetic packaging, PCBA, assembly, and testing/tuning—to shorten R&D cycles and reduce packaging costs.
Joint Project Applications: Collaborating to overcome critical technological bottlenecks in fields such as microwave technology and sensors, and jointly applying for national, provincial, and municipal science and technology projects.
Testing and Verification Services: Providing professional preliminary testing—including high/low-temperature, damp-heat, vibration, and burn-in screening—to ensure product reliability.
II. Business Details
01
Key Equipment
02
Custom Design of Microwave Component Products
Custom design services for microwave components covering the full DC–40 GHz frequency range. We provide end-to-end solutions based on customer specifications—including electrical and thermal performance, physical dimensions, and interface requirements—encompassing custom design, component selection and procurement, prototype fabrication, testing and tuning, and volume delivery.
03
Volume Contract Manufacturing: Micro-assembly, Ceramic-to-Metal Packaging, and Testing
We provide services where the customer supplies product drawings, process and performance specifications, and key materials (or we can handle material procurement). We then perform micro-assembly and testing/tuning (optional) before delivering the semi-finished micro-assembled units or fully tested finished products to the customer for acceptance.
04
Pilot production (small-batch) and preliminary reliability testing
Providing end-to-end services—from design to packaging verification—for universities, chip design companies, research institutes, and system manufacturers.
