Inspection Solutions for Multilayer Ceramics! Anshi Intelligent’s High-Efficiency Optical Inspection Systems for HTCC, LTCC, and MLCC.

Beijing Anshi Zhongdian Technology Co., Ltd. will participate in Aibang’s 8th Precision Ceramic Industry Chain Exhibition from August 26 to 28, 2026 (Booth No. A04). We warmly welcome industry colleagues to visit us and exchange ideas!

Company Profile

Beijing Anshi Zhongdian Technology Co., Ltd. is a national high-tech enterprise specializing in computer application technologies. Deeply rooted in the fields of computer vision and artificial intelligence, the company focuses on the R&D and service of intelligent inspection equipment for industries including third-generation semiconductors, wafers, ceramic substrates, chip packages, and packaging. Driven by technological innovation, the company leads the industry forward.

Leveraging proprietary large-scale AI models and complex logic algorithms, the company’s vision inspection systems enable comprehensive product inspection—covering top, bottom, side, and internal cavity surfaces for appearance defects and soldering quality—as well as precise dimensional measurement. These systems seamlessly integrate with MES, supporting the efficient upload and download of production recipes while meticulously recording and tracing inspection data and images to ensure efficiency, precision, and traceability throughout the production process.

Key Products:

Optical inspection solutions for HTCC/LTCC/MLCC applications:
Green Sheet/Ceramic Sheet AOI System
Via Hole AOI System
Via Filling AOI System
Circuit Pattern AOI System (Printing AOI)
Panel-Level Finished Product AOI System (Substrate AOI)
Singulated Finished Product AOI and Sorting System

These products are designed to meet the specific Automated Optical Inspection (AOI) needs across key process stages in advanced ceramic packaging and testing—including green sheets (tapes), via holes, via filling, circuit patterning, ceramic substrates, and finished product sorting. We possess the inspection technologies for these critical stages and provide users with comprehensive, systematic inspection solutions.

Product Introduction

AOI for Ceramic Green Sheets/Tapes

This inspection system is used to detect surface defects on products such as ceramic green sheets (tapes) and ceramic substrates. The equipment supports surface defect inspection both before and after the sheet-cutting process.

Through-Hole AOI

Through-Hole AOI enables comprehensive defect inspection of through-holes in panels processed via mechanical or laser drilling. It is suitable for various ceramic panels—including green and fired ceramics, with or without steel frames, and in sizes ranging from 6 to 12 inches—and performs a thorough inspection for various surface defects.

Via-Filling AOI

The Via-Filling AOI system performs comprehensive inspection for via-filling defects on panels. It is suitable for various ceramic via-filled panels—including green ceramic and fired ceramic types, with or without steel frames, and in sizes ranging from 6 to 12 inches—and conducts a thorough inspection for various surface defects.

Printed Circuit Pattern AOI

Circuit pattern inspection can be applied across various stages of green and fired ceramic processing. It supports the visual inspection of diverse surface circuit patterns—including screen-printed, photolithographic, and etched circuits—on products such as LTCC/HTCC/MLCC printed sheets, fired ceramic printed resistors, thin-film circuits, and thick-film circuits.