From Materials to Devices! Liaoning Light Industry Research Institute Unlocks Domestic Solutions for High-End Inorganic Non-Metallic Materials

From August 26 to 28, 2026, Liaoning Light Industry Science Research Institute Co., Ltd. will participate in the 8th Aibang Precision Ceramic Industry Chain Exhibition. We invite industry colleagues to visit us at Booth E21, Hall 7, Shenzhen World Exhibition & Convention Center.

Company Profile

Liaoning Light Industry Science Research Institute Co., Ltd. (hereinafter referred to as "LQLI") is a state-controlled, technology-driven enterprise. It operates as a comprehensive research institution specializing in the R&D and production of new inorganic non-metallic materials and products, as well as testing and inspection, pilot-scale validation, technology promotion, and talent cultivation.

LQLI has developed a diverse product portfolio that includes specialty industrial ceramics, functional ceramics, specialty inorganic powders, specialty glass, specialty ceramic coatings, specialty coatings, casting materials, electronic functional components, and green building materials. These products are widely used in sectors such as aviation, aerospace, defense, shipbuilding, casting, and petrochemicals.

Product Introduction

Zinc Oxide Varistor Arrays

Zinc Oxide Varistor Arrays are designed to provide transient overvoltage protection for aerospace electrical connectors, addressing reliability challenges for electrical systems operating in extreme aerospace environments. These devices feature rapid response times, high surge current handling capabilities, and excellent bidirectional voltage clamping performance. They are widely used in sectors such as aerospace, rail transportation, and information & communications, serving as core resistive components within multi-channel functional electrical connectors.

关键技术参数：

Technical Advantages:

Varistor planar array technology features a compact structure, small size, and light weight;
It offers high mechanical strength, strong resistance to shock and vibration, and high reliability;
It provides high surge current capacity, fast response times, and excellent voltage limiting characteristics;
It boasts superior temperature stability (–55°C to 125°C) and ease of installation;
When combined with capacitor planar arrays, it delivers comprehensive transient overvoltage protection and EMI filtering solutions.
Configurations range from simple two-hole units to complex 155-channel arrays; customization is available for circular and rectangular connectors, mixed-voltage designs, and mixed-configuration designs that include unfiltered feed-through contacts;

Array-style Filter Capacitors

Array-style filter capacitors are multi-channel filtering components specifically designed for aviation electrical connectors. These devices feature high voltage withstand, high capacitance density, low ESR, and stable performance across a wide temperature range. They enable efficient multi-channel EMI filtering, meeting the stringent requirements for signal integrity and high reliability in sectors such as aerospace, automotive electronics, and information communications.

Key technical parameters:

Multilayer Ceramic Fabrication Technology and Products

Leveraging proprietary slurry and printing technologies, the Institute achieves the precise stacking and co-firing of ceramic dielectric layers and internal electrodes to produce highly reliable multilayer ceramic functional devices and components. Our product portfolio encompasses MLCCs, LTCCs, HTCC substrates, and multilayer piezoelectric ceramics. Supporting 3D integration and flexible customization, we offer end-to-end services—ranging from material formulation and device design to mass production—tailored to specific customer application requirements. We welcome inquiries regarding potential collaborations.

Key Technical Parameters:

Application Example:

CVD Silicon Carbide Wafer Support Pins

CVD silicon carbide wafer support pins are critical precision components in semiconductor manufacturing equipment. They are primarily used to support, position, and transport wafers within high-temperature, corrosive process environments, ensuring wafer stability during processing while preventing contamination. These pins are utilized in wafer transport assemblies for high-temperature semiconductor process equipment, such as SiC epitaxy, MOCVD, and plasma etching systems.

Product Features and Advantages:

Ultra-high purity: >99.9995%; free from particle shedding and metal contamination.
Dense and non-porous: Theoretical density of 3.21 g/cm³; no open porosity.
High-temperature stability: Suitable for long-term use at 1500°C; minimal degradation of mechanical properties at high temperatures; excellent thermal shock resistance.
High thermal conductivity: Thermal conductivity exceeds 280 W/(m•K), ensuring uniform temperature at support points.
Chemical inertness: Resistant to corrosion from dry/wet oxygen, nitrogen, hydrogen, and fluorine-containing plasma environments, as well as cleaning agents such as HF, HCl, and H2SO4.
Coefficient of thermal expansion: Matches that of silicon wafers, resulting in low thermal stress during heating and cooling cycles.

High-Alumina Firing Plate

The high-alumina firing plate is manufactured using high-purity multi-component powder raw materials, processed via mixed granulation and dry pressing, and finally sintered at high temperatures. It features high flexural strength at elevated temperatures, a low high-temperature creep rate, and excellent thermal shock resistance. It is suitable for processes such as binder burnout and sintering of various ceramics or composite materials, and is widely used in pusher-plate kilns for sintering electronic and structural ceramics.

Product Features and Advantages:

Thermal Shock Resistance: Excellent thermal shock resistance; withstands six cycles of water quenching from 1,200°C without cracking.
High Strength: High strength at elevated temperatures and robust load-bearing capacity.
Creep Resistance: Low creep rate at high temperatures, resulting in minimal deformation during long-term high-temperature use.

Black Alumina

Black alumina is produced using high-purity, multi-component powder raw materials and manufactured via high-temperature sintering following various forming processes—such as dry pressing, tape casting, injection molding, and cold isostatic pressing. It offers excellent properties, including high strength, superior insulation, and high light-shielding capabilities, making it widely applicable in sectors such as semiconductors, electronics, and optics.

Product Features and Advantages:

Optical Properties: Low visible light reflectance (below 10%).
Electrical Properties: Controllable resistivity (10⁶–10¹² Ω·cm), meeting requirements for insulating packaging and electrostatic discharge (ESD) design.
Thermal Properties: High thermal conductivity and high radiative heat dissipation performance.
Mechanical Properties: High flexural strength, high hardness, and excellent wear resistance.

Ceramic Metallization and Sealing Components

The ceramic metallization and sealing components independently developed and manufactured by the Institute feature excellent insulation, outstanding mechanical strength, superior hermeticity, and high-temperature resistance. Thanks to these multifaceted performance advantages, the products are highly adaptable for use in ceramic packaging housings, aerospace, oil exploration, new energy vehicles, vacuum electronic devices, and various other fields.

Key technical parameters:

High-Precision, Complex-Geometry Ceramic 3D Digital Manufacturing Technology and Products

Utilizing 3D digital manufacturing technology for high-precision, complex-geometry ceramics, this process produces ceramic components featuring complex structures, micron-level resolution, and superior surface quality. These products offer mechanical properties comparable to those of ceramics made via traditional methods, while providing advantages such as shorter production cycles, mold-free forming, design freedom, and customization capabilities. Ceramic components with complex structures can be custom-designed and manufactured to meet specific client needs, addressing critical demands for high-precision, high-quality, and complex ceramic parts in sectors such as 5G communications, aerospace, biomedicine, and high-end equipment manufacturing.

Key technical parameters:

High-Purity Silicon Nitride Powder for Electronic Substrates

Qingke Institute produces high-purity silicon nitride powder (SN-A) for electronic substrates using proprietary, patented technology. Characterized by high α-phase content, low oxygen levels, and high purity—along with uniform particle size and high sintering activity—this powder is used in the manufacture of electronic substrates, breaking foreign monopolies and enabling domestic substitution.

Powder performance specifications:

Product Applications:

High-Temperature Resistant, Hydrophobic Conformal Coating

Qingkeyuan offers a high-temperature resistant, hydrophobic conformal coating with excellent compatibility, suitable for both domestic and imported automated equipment. It features a rapid curing time of ≤10 seconds and allows for rework via wiping after curing. Forming a 5–20 µm coating, it provides robust anti-corrosion protection capable of withstanding temperatures up to 200°C.

Product Performance:

High protective efficiency: Suitable for long-term use at 200°C; withstands over 4,000 hours of neutral salt spray and over 2,000 hours of acidic salt spray; does not impede component heat dissipation.
Safe and eco-friendly: Fluorine-free and RoHS compliant; exhibits excellent hydrophobicity with a contact angle of ≥108°.

Electronic Glass Pastes

Qingke Institute offers the LNBT-JL series of glass pastes, covering both lead-containing and lead-free systems. With sintering temperatures ranging from 430°C to 920°C, these products meet the requirements of diverse sectors, including MEMS packaging, semiconductor sealing, military-grade components, and new energy applications.

Product performance specifications:

Core Product Functions:

Hermetic Sealing: A dense glass layer blocks moisture and contaminants; helium mass spectrometry leak rate ≤1×10⁻10 Pa·m³/s.
High-Resistance Insulation: Volume resistivity ≥10¹² Ω·cm; blocks leakage current and prevents circuit short circuits.
High-Strength Inorganic Bonding: Forms stable chemical bonds with ceramic, metal, and silicon substrates; resistant to thermal shock.
Weather and Corrosion Resistance: Withstands acid/alkali erosion and harsh environmental conditions; extends device service life.

High-Purity Yttrium Oxide Powder

Using proprietary technology, the Institute produces high-purity yttrium oxide powder characterized by superior high-temperature resistance, electrical insulation, high-temperature chemical stability, and resistance to plasma etching. It maintains excellent thermal performance in corrosive gas environments and is used in the semiconductor industry (e.g., electrostatic chucks, vacuum chamber walls), engine components, and specialized industrial sectors, thereby breaking foreign monopolies and enabling domestic substitution.

Powder Properties:

Product Applications:

Recommended Event 1:

Aibang’s 8th Precision Ceramics Forum (Featuring 10 Key Themes) [August 26–28, 2026 | Hall 7, Shenzhen World Exhibition & Convention Center (Bao'an New Venue)]

Recommended Event #2: Claim Your Free Admission Ticket | Attendee Pre-registration for the 8th Precision Ceramics Exhibition Is Now Open! (August 26–28 · Shenzhen)

Attendee Pre-registration:

Method 1: Step 1 – Follow the "Aibang Ceramics Exhibition" (艾邦陶瓷展) WeChat Official Account (scan the QR code below or click the account card); Step 2 – Select "Attendee Registration" from the bottom menu.

Method 2:

Scan the QR code or copy the link to register:

https://www.aibang360.com/sign/100085

2. Professional VIP Attendee Registration:

VIP Attendee Benefits: Complimentary drinking water, a lunch voucher, and the exhibition directory.

VIP Group Benefits (15+ people): Dedicated shuttle service within Guangdong Province.

Target VIP Audience: Power semiconductor modules (IGBT/SiC/PIM), packaging & testing, MLCC/LTCC/HTCC, electronic ceramic components, ceramic copper-clad substrates (AMB/DBC/DPC), communication equipment, optical communication modules, 3C consumer electronics, and automotive electronics.

For VIP and group registration, please contact Ms. Wen at 18126443075 (also her WeChat ID).

※ Minors under the age of 18 are not permitted to visit; please do not bring children inside.