High-precision printing machines + fully automatic stacking machines: Kunshan Hebo's core MLCC forming equipment is suitable for component production across diverse sectors.

From August 26 to 28, 2026, Kunshan Heboxichuang Electronic Technology Co., Ltd. will participate in Aibang’s 8th Precision Ceramic Industry Chain Exhibition (Booth No. G66). We warmly invite industry colleagues to visit us and exchange ideas!

PART 01

Company Profile

Founded in 2005, Hebo Technology specializes in the R&D and manufacturing of full-process equipment for passive components (resistors, capacitors, and inductors), non-standard automation systems, intelligent manufacturing equipment, and high-precision parts and consumables; the company’s technologies and services have earned high acclaim from clients.

As an industry leader, the company has garnered over 20 national and provincial honors, including recognition as a national-level "Little Giant" enterprise (specializing in niche markets with cutting-edge technologies), a High-Tech Enterprise, a Jiangsu Private Sci-Tech Enterprise, and a Leading Service Provider for Intelligent Manufacturing in Jiangsu Province. It holds more than 100 patents and has obtained certifications such as ISO9001 and CE.

Hebo Group has established branches across regions and countries including Kunshan, Suzhou, Wuxi, Dongguan, Chuzhou, Chengdu, Taiwan, and Malaysia. Hebo’s products account for approximately 80% of the domestic market share and about 30% of the international market share for passive component equipment.

Guided by a business philosophy that prioritizes customers and quality while driving progress through innovation and pragmatic execution, Hebo Xinchuang provides comprehensive, end-to-end services—including process optimization, production line planning, equipment customization, and after-sales support. The company’s products are distributed across China, and it engages in the import and export of both goods and technology. Looking ahead, Hebo Xinchuang will continue to deepen its presence in the high-end equipment sector for passive components, focusing on micron-level precision intelligent manufacturing technologies, with the aim of becoming a leading global provider of integrated intelligent manufacturing services for electronic components.

PART 02

Product Illustration

Roll-to-Roll Printing Machine

Equipment Specifications:

Screen frame size: 750 × 750 mm; 800 × 800 mm

Printing area: 310 × 310 mm (compatible with 440 × 440 mm)

Squeegee speed: Max. 1000 mm/s (dual servo motors)

Cycle time (mechanical speed): Max. 2.5 seconds

Oven: 2m length, 3 independent zones; max. temperature 100°C; operating temperature 95°C ±3°C

Max. roll diameter for winding/unwinding (including ceramic tape): Max. Ø500 mm

Pinhole detection system: Detects pinholes as small as Ø0.1 mm in the transport section.

Roll-to-Roll Lamination Machine

Equipment Specifications:

Thin sheet dimensions: 310 × 310 mm & 440 × 440 mm

Stack height: Max. 5 mm (<1,000 layers)

Minimum ceramic film peel capability: 1.2 µm

Cycle time (mechanical speed): Approx. 4.8 s (excluding lamination time)

Mechanical positioning accuracy: ±1 µm

Stacking accuracy: ±10 µm

Fully Automatic Dipping and Plating Machine

Equipment Specifications:

Compatible Component Sizes: 0201, 0402, 0603, 0805

Placement/Insertion Rate: >98%

Cycle Time: 28s/pc

Squeegee Precision: ≤0.005mm

Paste Application Precision: <0.005mm

Equipment Cycle Time: 28s/pc (Standard); 36s/pc (Spiral mode)

Batch Changeover Method: Automatic batch differentiation via software (color-based)

Silver Dipping Methods: Reverse dipping, spiral dipping, dipping-degassing-reverse dipping, etc.

Unloading/Collection Method: Tape peeling; thermal release of foam tape

Chip Stacking Machine

(Peel-then-Stack & Stack-then-Peel modes)

Equipment Specifications:

Film/Substrate Size: 6-inch, 8-inch, and 10-inch products (customizable)

Stack Height: Max. 10 mm (customizable)

Stacking Pressure: 4–70 tonf; pressure accuracy within ±2%

Mold Temperature: 5°C–100°C; temperature uniformity ±2°C

Cycle Time (Machine Speed): Approx. 12s (excluding bonding/pressing time)

Mechanical Positioning Accuracy: ±1 µm

Stacking Accuracy: ±10 µm

*Note: The product offering includes full-line equipment; only selected items are displayed here.

Recommended Event 1:

Aibang’s 8th Precision Ceramics Forum (Featuring 10 Major Themes) [August 26–28, 2026 | Hall 7, Shenzhen World Exhibition & Convention Center (Bao'an New Venue)]

Recommended Event #2: Claim Your Free Admission Ticket | Attendee Pre-registration for the 8th Precision Ceramics Exhibition Is Now Open! (August 26–28 · Shenzhen)

Attendee Pre-registration:

Method 1: Step 1 – Follow the "Aibang Ceramics Exhibition" (艾邦陶瓷展) WeChat Official Account (scan the QR code below or click the account card); Step 2 – Select "Attendee Registration" from the bottom menu.

Method 2:

Scan the QR code or copy the link to register:

https://www.aibang360.com/sign/100085

2. Professional VIP Attendee Registration:

VIP Attendee Benefits: Complimentary bottled water, lunch voucher, and exhibition directory.

VIP Group Benefits (15+ people): Dedicated shuttle service within Guangdong Province.

Target VIP Audience: Power semiconductor modules (IGBT/SiC/PIM), packaging & testing, MLCC/LTCC/HTCC, electronic ceramic components, ceramic substrates (AMB/DBC/DPC), communication equipment, optical communication modules, 3C consumer electronics, and automotive electronics.

For VIP and group registration, please contact Ms. Wen at 18126443075 (also her WeChat ID).

※ Minors under the age of 18 are not permitted to visit; please do not bring children inside.