Dongguan Lizhi’s high-precision grinding and polishing solutions achieve ultimate flatness for ceramic substrates.

From August 26 to 28, 2026, Dongguan Lizhi Grinding Technology Co., Ltd. will participate in the 8th Aibang Precision Ceramics Industry Chain Exhibition (Booth No. D21). We warmly invite industry colleagues to visit us and exchange ideas!

01

Company Profile

Established in 2023 and based in Songshan Lake, Dongguan, Dongguan Lizhi Abrasive Technology Co., Ltd. is a high-tech enterprise integrating the R&D, design, manufacturing, and sales of CMP (Chemical Mechanical Polishing) products, with a strategic focus on both CMP polishing pads and slurries.

Dongguan Lizhi is dedicated to bridging the technological gap in high-end polishing pads within the domestic market, acting as a trailblazer in the field of CMP consumables. Regarding polishing pads, the company has mastered core microporous foaming control technology, enabling precise regulation of pore size distribution and uniformity in porous polyurethane materials to ensure high material removal rates and low defect rates during the polishing process. Backed by a 100% proprietary intellectual property system and advanced testing laboratories, the company implements a closed-loop control process spanning everything from raw material synthesis to finished product processing, thereby guaranteeing batch-to-batch consistency and superior product quality.

The core product is the non-woven CMP (Chemical Mechanical Planarization) polishing pad, which directly benchmarks against the mainstream international DuPont SUBA series; its key performance indicators match those of imported products. Thanks to a unique non-woven substrate treatment process, the product excels in flatness, wear resistance, and compatibility.

As downstream core manufacturing processes become increasingly precise, CMP technology is finding wider application across the broader semiconductor industry.

Thinning and polishing of third-generation semiconductor substrates, including Silicon Carbide (SiC) and Gallium Nitride (GaN);

Optoelectronics and infrared: processing of sapphire substrates, infrared crystals, and LED wafers;

Advanced materials: precision polishing of high-performance ceramic substrates and hard-to-machine materials such as titanium alloys;

3C consumer electronics: grinding and processing of mobile phone back-glass, ceramics, and metal middle frames.

02

Core Products

01

Non-woven Polishing Pads

The LZNW series of non-woven polishing pads is primarily designed for polishing applications. They are manufactured using high-quality polyester fibers and a dry-laid forming process that precisely controls the pad's structural composition. Grooving or embossing can be customized to meet specific process requirements, thereby enhancing slurry flow and improving both polishing efficiency and precision. These pads are characterized by high polishing rates, superior surface quality, high material removal rates, and a long service life.

02

Damping Cloth Polishing Pads

The LZZN series consists of composite foam materials made from a combination of velour-like non-woven fabric and specialized polyurethane. These pads feature a flat, soft, and velvety surface that is exceptionally fine, porous, and elastic. Primarily used for final precision polishing, they deliver high cutting power while ensuring excellent flatness and minimal surface damage—preventing workpiece scratches and meeting the stringent requirements for high-gloss, ultra-smooth mirror finishes on end products.

03

Polyurethane Polishing Pads

These pads are manufactured using a precision micro-cellular foaming process with specialized polyurethane. Depending on the specific abrasive materials and processing requirements, the pads are available with various fillers—such as cerium oxide, zirconium oxide, or aluminum oxide. They offer high material removal rates and excellent wear resistance. The use of different fillers meets diverse application needs, ensuring minimal surface scratching on the workpiece and a long service life, thereby reducing costs and enhancing efficiency in high-precision manufacturing processes.

03

Solutions

01

Ceramic Substrates and Ceramic Smartphone Bodies

Specialty ceramic materials (such as Zirconia/ZrO₂, Alumina/Al₂O₃, and Aluminum Nitride/AlN) are widely used in applications ranging from high-end smartphone back covers and wearable device casings to high-power semiconductor packaging substrates, thanks to their extreme hardness, superior wear resistance, excellent heat dissipation, and outstanding electromagnetic transparency.

Addressing the technical challenges associated with ceramic materials—specifically their susceptibility to micro-cracking and the difficulty of controlling surface flatness—Lizhi Grinding has developed a specialized combination of diamond lapping/grinding fluids and high-precision polishing pads. This solution is designed for the ultra-smooth double-sided processing of ceramic substrates and the mirror-finish polishing of complex, curved 3D ceramic smartphone back covers.

Standard processing workflow: Forming and sintering → CNC rough shaping → Double-sided rough grinding/thinning → Single/double-sided fine grinding → Curved/flat surface rough polishing → Precision cleaning → Fine polishing → Final inspection.

02

Silicon Carbide (SiC) Wafer Substrates

To address the physical challenges posed by the high hardness and difficult processability of silicon carbide (SiC), we provide comprehensive, customized consumable solutions covering the entire process—from cutting, thinning, and grinding to polishing. While ensuring strict adherence to rigorous processing parameters, we continuously optimize our processes through targeted adjustments tailored to the specific conditions of the customer's production line.

Cutting Process:

A. Cutting fluid NC0630, used with steel wire for ingot cutting

B. Diamond cutting wire DL180, used with coolant

Rough Polishing Process:

A. Potassium permanganate/alumina rough polishing slurry + non-woven abrasive pad

Lapping Process:

A. Monocrystalline diamond lapping slurry + cast iron plate

B. Agglomerated diamond lapping slurry + honeycomb rough grinding pad

Thinning Process:

Diamond thinning grinding wheels (DBG800/DBG1000/DBG2000/DBG8000)

Fine Polishing Process:

Two-component silica fine polishing slurry + black damping cloth polishing pad

Fine Grinding Process:

A. Polycrystalline diamond grinding slurry + polyurethane fine grinding pad

B. Agglomerated diamond grinding slurry + polyurethane fine grinding pad

03

Sapphire Optical Elements

Thanks to its extreme hardness and excellent light transmission, sapphire material is widely used in mobile phone camera protective covers, professional camera lenses, drone lens assemblies, high-end smartwatch crystals, automotive vision systems, and precision optical systems for various optoelectronic instruments.

We provide comprehensive abrasive and polishing slurry solutions tailored to mainstream optical lens polishing processes (including mechanical polishing, chemical polishing, and chemical-mechanical polishing/CMP); all three methods require specialized lapping/polishing slurries (or powders). Typically, coarse-grit slurries (or powders) are used in the initial rough grinding stages, while high-purity, fine polishing slurries (or powders) are employed in the final precision polishing stages to ensure the achievement of flawless optical-grade surface requirements.

Recommended Consumable Solutions:

Cutting Process: Diamond wire + Cutting fluid

Lapping Process: Agglomerated diamond slurry + Honeycomb copper lapping plate (for C-plane sapphire surfaces)

Polishing Process: Silica polishing slurry + Non-woven polishing pad (for C-plane sapphire surfaces)

04

Sapphire Substrates

We provide mature and reliable consumable solutions for mainstream sapphire substrate sizes, such as 4-inch and 6-inch wafers. Current lapping and polishing processes for sapphire substrates primarily utilize single-sided wax mounting, demanding extremely high standards for flatness and surface roughness.

Standard Processing Workflow:

Cutting – Thinning – Double-sided rough lapping – Single-sided fine lapping – Single-sided polishing – Cleaning – Packaging

Recommended consumable combinations:

Cutting process: Cutting fluid + diamond cutting wire;

Fine grinding process: Agglomerated diamond grinding fluid + non-woven grinding pad;

Rough grinding process: Boron carbide grinding fluid + cast iron plate;

Polishing process: Silicon oxide polishing fluid + non-woven polishing pad.

Recommended Event 1: Aibang’s 8th Precision Ceramics Industry Chain Exhibition [August 26–28, 2026 | Hall 7, Shenzhen World Exhibition & Convention Center (Bao'an New Venue)]

Booth Booking

Ms. Li: 18823755657 (WeChat ID)

Email: lirongrong@aibang.com

Scan the QR code to add on WeChat and inquire about exhibition details.

Recommended Event 2: 9 Concurrent Forums

How to register as an attendee:

Scan the QR code or copy the link to register.

https://www.aibang360.com/sign/100085